POWER SEMICONDUCTOR MODULE
First Claim
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1. A power semiconductor module comprising:
- a heat dissipation substrate electrically connected to a common connection terminal; and
a plurality of electronic elements disposed on the heat dissipation substrate,wherein the electronic elements have varying spaces therebetween.
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Abstract
There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.
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Citations
15 Claims
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1. A power semiconductor module comprising:
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a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A power semiconductor module comprising:
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a common connection terminal; and a plurality of electronic elements disposed in a row from the common connection terminal and electrically connected to the common connection terminal, wherein the electronic elements are disposed such that spaces therebetween are reduced in a direction away from the common connection terminal.
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Specification