Cooling Apparatuses Having A Jet Orifice Surface With Alternating Vapor Guide Channels

• US 20140190668A1
• Filed: 01/04/2013
• Published: 07/10/2014
• Est. Priority Date: 01/04/2013
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Motor Engineering & Manufacturing North America Incorporated (Toyota Motor Corporation)
• Inventors: Joshi, Shailesh N., Kuhlmann, Joshua Sean, Rau, Matthew Joseph, Gaikwad, Mayur Prakash
• Granted Patent: US 9,460,985 B2
• Time in Patent Office: Days
• US Class Current: 165/104.33
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Jet-impingement, two-phase cooling apparatuses having alternating vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface, and a target surface. The jet orifice surface includes an array of jet orifices. The jet orifices are arranged in rows. Coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets. The jet orifice surface further includes a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels. The target surface has a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis, wherein the jet orifice surface is positioned proximate the surface fins.

Claims

1. A cooling apparatus comprising:

a fluid inlet channel;

a jet orifice surface comprising;

an array of jet orifices comprising a plurality of jet orifice rows, wherein coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets; and

a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels; and

a target surface comprising a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis, wherein the jet orifice surface is positioned proximate the plurality of surface fins.

2. The cooling apparatus of claim 1, wherein:

the impingement jets of coolant fluid impinge the target surface between adjacent surface fins;

at least a portion of the coolant fluid enters the plurality of vapor guide channels and flows away from an impingement region of the target surface in directions along the first axis; and

at least a portion of the coolant fluid flows away from the impingement region of the target surface between the surface fins in directions along the second axis.

3. The cooling apparatus of claim 1, further comprising a plurality of horizontal outlet channels defining a coolant fluid chamber, wherein the coolant fluid chamber is fluidly coupled to the plurality of horizontal outlet channels, the plurality of vapor guide channels, and areas between adjacent surface fins.

4. The cooling apparatus of claim 3, further comprising a fluid outlet fluidly coupled to the plurality of horizontal outlet channels.

5. The cooling apparatus of claim 1, further comprising:

a coolant fluid chamber, wherein the coolant fluid chamber is fluidly coupled to the plurality of vapor guide channels and areas between adjacent surface fins; and

a plurality of sloped vapor outlet channels fluidly coupled to the coolant fluid chamber, wherein each sloped vapor outlet channel slopes in a direction that is both away from the jet orifice surface and opposite from a direction of the impingement jets, and the coolant fluid in the form of vapor and/or fluid flows through the plurality of sloped vapor outlet channels after the coolant fluid impinges the target surface.

6. The cooling apparatus of claim 1, further comprising an insulation assembly and a heat generating device coupled to the insulation assembly and the target surface.

7. The cooling apparatus of claim 6, wherein the heat generating device is a semiconductor device.

8. A cooling apparatus comprising:

a jet plate manifold, wherein the jet plate manifold is configured to receive a coolant fluid;

a jet orifice surface within the jet plate manifold, the jet orifice surface comprising;

an array of jet orifices comprising a plurality of jet orifice rows, wherein coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets; and

a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels;

a vapor manifold having an opening, wherein the jet plate manifold is disposed within the opening of the vapor manifold such that a plurality of vapor outlet channels is located between the jet plate manifold and the vapor manifold; and

a target surface coupled to the vapor manifold, wherein the impingement jets strike the target surface, and at least some of the coolant fluid changes to a vapor that enters the plurality of vapor guide channels of the jet orifice surface.

9. The cooling apparatus of claim 8, wherein the target surface comprises a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis.

10. The cooling apparatus of claim 9, wherein:

the jet orifice surface is positioned proximate the plurality of surface fins;

the impingement jets of coolant fluid impinge the target surface between adjacent surface fins;

at least a portion of the coolant fluid enters the plurality of vapor guide channels and flows away from an impingement region of the target surface in directions along the first axis;

at least a portion of the coolant fluid flows away from the impingement region of the target surface between the surface fins in directions along the second axis; and

the coolant fluid flows into the plurality of vapor outlet channels and exits the cooling apparatus.

11. The cooling apparatus of claim 8, wherein:

the cooling apparatus further comprises a jet orifice plate comprising;

a flange portion; and

an opening on a surface of the flange portion, wherein the jet orifice surface is provided on the jet orifice plate opposite the flange portion such that a jet channel is located between the opening and the jet orifice surface;

the jet plate manifold comprises a jet plate manifold opening and a seat within the jet plate manifold opening; and

the jet orifice plate is disposed within the jet plate manifold opening such that the flange portion is positioned on the seat.

12. The cooling apparatus of claim 8, wherein:

the jet plate manifold comprises a tapered portion and a jet plate manifold opening;

the vapor manifold comprises a plurality of tapered walls defining the opening;

the tapered portion of the jet plate manifold is disposed within the opening of the vapor manifold such that the plurality of vapor outlet channels are located between the plurality of tapered walls of the vapor manifold and the tapered portion of the jet plate manifold; and

each vapor outlet channel of the plurality of vapor outlet channels slopes in a direction that is both away from the jet orifice surface and opposite from a direction of the impingement jets.

13. The cooling apparatus of claim 12, wherein the plurality of tapered walls is substantially parallel to the tapered portion of the jet plate manifold.

14. The cooling apparatus of claim 12, wherein:

the tapered portion of the jet plate manifold extends from an upper portion having a plurality of walls;

a plurality of slot channels are disposed within the plurality of walls of the upper portion; and

the plurality of slot channels are fluidly coupled to the plurality of vapor outlet channels.

15. The cooling apparatus of claim 14, further comprising an inlet-outlet manifold coupled to the jet plate manifold, the inlet-outlet manifold comprising:

a fluid inlet;

an inlet manifold channel fluidly coupled to the fluid inlet and the jet plate manifold opening;

a plurality of outlet manifold channels fluidly coupled to the plurality of slot channels of the jet plate manifold; and

a fluid outlet fluidly coupled to the plurality of outlet manifold channels.

16. The cooling apparatus of claim 15, wherein:

the plurality of outlet manifold channels is defined by a first outlet manifold channel, a second outlet manifold channel, a third outlet manifold channel, and a fourth outlet manifold channel, wherein the first through fourth outlet manifold channels are fluidly coupled;

the fluid outlet is positioned above the first outlet manifold channel, and the fourth outlet manifold channel is opposite from the first outlet manifold channel;

the fourth outlet manifold channel has a height that is shorter than the first outlet manifold channel; and

the second outlet manifold channel and the third outlet manifold channel slope upwardly toward the first outlet manifold channel and the fluid outlet.

17. The cooling apparatus of claim 8, further comprising an insulation assembly and a semiconductor device coupled to the insulation assembly and the target surface.

18. A cooling apparatus comprising:

an inlet-outlet manifold, the inlet-outlet manifold comprising;

a fluid inlet configured to receive a coolant fluid;

an inlet manifold channel fluidly coupled to the fluid inlet;

a plurality of outlet manifold channels; and

a fluid outlet fluidly coupled to the plurality of outlet manifold channels;

a jet plate manifold coupled to the inlet-outlet manifold, the jet plate manifold comprising;

an upper portion comprising a plurality of walls;

a plurality of slot channels within the plurality of walls, wherein the plurality of slot channels are fluidly coupled to the plurality of outlet manifold channels;

a tapered portion extending from the upper portion;

a jet plate manifold opening extending through the upper portion and the tapered portion wherein the jet plate manifold opening is fluidly coupled to the inlet manifold channel; and

a seat within the jet plate manifold opening;

a jet orifice plate disposed within the jet plate manifold opening, the jet orifice plate comprising;

a flange portion, wherein the jet orifice plate is disposed within the jet plate manifold opening such that the flange portion is positioned on the seat; and

a jet orifice surface opposite from the flange portion, the jet orifice surface comprising;

an array of jet orifices comprising a plurality of jet orifice rows;

a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels; and

a jet channel, wherein the jet channel is fluidly coupled to the inlet manifold channel, and the coolant fluid flows through the array of jet orifices as impingement jets;

a vapor manifold comprising a plurality of tapered walls defining an opening, wherein;

the tapered portion of the jet plate manifold is disposed within the opening of the vapor manifold such that a plurality of vapor outlet channels are located between the plurality of tapered walls of the vapor manifold and the tapered portion of the jet plate manifold; and

each vapor outlet channel of the plurality of vapor outlet channels slopes in a direction that is both away from the jet orifice plate and opposite from a direction of the impingement jets; and

a target surface coupled to the vapor manifold, wherein at least some of the coolant fluid changes to a vapor that enters the plurality of vapor guide channels of the jet orifice surface.

19. The cooling apparatus of claim 18, wherein:

the target surface comprises a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis;

the jet orifice surface is positioned proximate the plurality of surface fins;

the impingement jets of coolant fluid impinge the target surface between adjacent surface fins;

at least a portion of the coolant fluid enters the plurality of vapor guide channels and flows away from an impingement region of the target surface in directions along the first axis;

at least a portion of the coolant fluid flows away from the impingement region of the target surface between the surface fins in directions along the second axis; and

the coolant fluid flows into the plurality of vapor outlet channels and exits the cooling apparatus.

20. The cooling apparatus of claim 18, further comprising an insulation assembly and a semiconductor device coupled to the insulation assembly and the target surface.