APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT
First Claim
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1. An apparatus for processing e-waste, said apparatus comprising:
- (a) a mechanical solder removal module; and
(b) a chemical solder removal module;
wherein the modules are contiguously attached to one another.
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Accused Products
Abstract
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
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Citations
19 Claims
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1. An apparatus for processing e-waste, said apparatus comprising:
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(a) a mechanical solder removal module; and (b) a chemical solder removal module; wherein the modules are contiguously attached to one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of recycling e-waste comprising:
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removing at least a portion of the solder using a mechanical solder remover, wherein the mechanical solder remover comprises at least one blade and at least one agitator for the mechanical removal of solder from the surface; removing at least a portion of the solder using a chemical solder remover, wherein the chemical solder remover comprises a container for a first composition and at least one agitator, wherein the PWB is partially immersed in the first composition; and removing at least a portion of a precious metal using a leaching composition.
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18. An apparatus for processing e-waste, said apparatus comprising:
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(a) a heating module for removing casing or epoxied components from a PWB; and (b) a chemical solder removal module, wherein the modules are contiguously attached to one another.
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19-33. -33. (canceled)
Specification