INTEGRATED LED-BASED LUMINAIRE FOR GENERAL LIGHTING

• US 20140192527A1
• Filed: 02/04/2013
• Published: 07/10/2014
• Est. Priority Date: 10/09/2007
• Status: Active Grant

• Current Assignee: Signify North America Corporation (Signify N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: DOWLING, Kevin J., Williamson, Ryan C., Roberge, Brian, Roberts, Ron, Morgan, Frederick, Datta, Michael Jay, Lys, Ihor A., Mollnow, Tomas Jonathan
• Granted Patent: US 9,429,279 B2
• Time in Patent Office: Days
• US Class Current: 362/231
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05B 45/28 using temperature feedback
• CPC Class Codes: H05B 45/3725 Switched mode power supply [SMPS]
• CPC Class Codes: H05B 45/375 using buck topology
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

Lighting apparatus and methods employing LED light sources are described. The LED light sources are integrated with other components in the form of a luminaire or other general purpose lighting structure. Some of the lighting structures are formed as Parabolic Aluminum Reflector (PAR) luminaires, allowing them to be inserted into conventional sockets. The lighting structures display beneficial operating characteristics, such as efficient operation, high thermal dissipation, high output, and good color mixing.

Claims

1. An illumination apparatus comprising:

an LED-based light source (150) comprising a first die (202) and a second die (204) coupled to a substrate (206), the first die configured to produce a first spectrum of radiation (503) and the second die configured to produce a second spectrum of radiation (505), the LED-based light source further comprising a primary optic (203) having first texturing (205, 207) on at least a portion thereof; and

a secondary optic (160) coupled to the LED-based light source (150) and configured to collimate light produced by the LED-based light source (150), wherein the secondary optic has second texturing (167) on at least a portion of a light receiving surface of the secondary optic.

2. The apparatus of claim 1, wherein the primary optic comprises a hemispherical lens (203) raised a distance (H₁) above the substrate (206).

3. The apparatus of claim 1, wherein the secondary optic forms an exit aperture through which light produced by the LED-based light source passes, and wherein there is no diffusing element across the exit aperture.

4. The apparatus of claim 1, further comprising a heat sink to which the LED-based light source is thermally coupled, and a thermal connector mounted in or on the heat sink.

5. The apparatus of claim 4, further comprising an element mechanically coupled to the heat sink and having a cavity therein for receiving power circuitry for providing power to the LED-based light source, the element configured to mate to a screw base.

6. The apparatus of claim 5, further comprising the power circuitry, and a flexible circuit interconnecting the LED-based light source and the power circuitry.

7. The apparatus of claim 4, further comprising a housing formed of electrically non-conducting material, and wherein the LED-based light source, the secondary optic, and the heat sink are disposed within the element.

8. The apparatus of claim 7, wherein the housing defines one or more holes configured to facilitate heat dissipation.

9. The apparatus of claim 8, further comprising a cover lens coupled to the housing, wherein the cover lens and housing in combination substantially surround the LED-based light source, the secondary optic, and the heat sink.

10. The apparatus of claim 4, wherein the thermal connector is a copper plug.

11. The apparatus of claim 10, wherein the copper plug has a first surface raised above the heat sink, and wherein the LED-based light source is mounted on the first surface of the copper plug.

12. The apparatus of claim 11, further comprising a temperature sensor mounted within or proximate to the heat sink and thermally coupled to the LED-based light source.

13. The apparatus of claim 1, wherein the secondary optic has an exit aperture, and wherein the apparatus further comprises a diffuser disposed across the exit aperture.