SOCKET TYPE MEMS BONDING
First Claim
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1. A method comprising:
- providing a first substrate;
bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and
bonding a third substrate to the first substrate.
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Abstract
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate.
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Citations
20 Claims
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1. A method comprising:
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providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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providing a first, second, and third substrate; bonding the second substrate to the first substrate; patterning the second substrate to form a MEMS device and a cavity extending through the second substrate to expose a portion of the first substrate; patterning the third substrate to form a stand-off portion; and bonding the third substrate to the first substrate by bringing the stand-off portion in contact with the exposed portion of the first substrate through the cavity. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method comprising:
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providing a first substrate; positioning a second substrate over the first substrate, the second substrate being distinct from the first substrate and including a microeelectromechanical system MEMS device and a cavity extending through the second substrate; and positioning a stand-off portion of a third substrate through the cavity of the second substrate, wherein an open space separates the cavity of the second substrate from the stand-off portion of the third substrate. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification