SEPARATING APPARATUS
First Claim
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1. A separating apparatus, comprising:
- a base carrying an electronic device comprising a first substrate, a second substrate, and an adhesive layer adhering the first substrate and the second substrate to each other; and
a wire configured on the base, wherein a wire diameter of the wire is equal to or greater than a thickness of the adhesive layer.
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Abstract
A separating apparatus, including a base and a wire, is provided. The base is adapted for carrying an electronic device. The electronic device includes a first substrate, a second substrate, and an adhesive layer. The adhesive layer adheres the first substrate and the second substrate to each other. The wire is configured on the base. A wire diameter of the wire is equal to or greater than a thickness of the adhesive layer.
13 Citations
11 Claims
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1. A separating apparatus, comprising:
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a base carrying an electronic device comprising a first substrate, a second substrate, and an adhesive layer adhering the first substrate and the second substrate to each other; and a wire configured on the base, wherein a wire diameter of the wire is equal to or greater than a thickness of the adhesive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification