FinFET Device and Method of Fabricating Same
First Claim
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1. An integrated circuit structure comprising:
- a semiconductor substrate;
isolation regions extending into the semiconductor substrate, wherein the isolation regions comprise opposite sidewalls facing each other; and
a fin structure comprising;
a silicon fin higher than top surfaces of the isolation regions;
a germanium-containing semiconductor region overlapped by the silicon fin;
silicon oxide regions on opposite sides of the germanium-containing semiconductor region; and
a first germanium-containing semiconductor layer between and in contact with the silicon fin and one of the silicon oxide regions.
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Abstract
An integrated circuit structure includes a semiconductor substrate, and isolation regions extending into the semiconductor substrate, wherein the isolation regions have opposite sidewalls facing each other. A fin structure includes a silicon fin higher than top surfaces of the isolation regions, a germanium-containing semiconductor region overlapped by the silicon fin, silicon oxide regions on opposite sides of the germanium-containing semiconductor region, and a germanium-containing semiconductor layer between and in contact with the silicon fin and one of the silicon oxide regions.
72 Citations
20 Claims
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1. An integrated circuit structure comprising:
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a semiconductor substrate; isolation regions extending into the semiconductor substrate, wherein the isolation regions comprise opposite sidewalls facing each other; and a fin structure comprising; a silicon fin higher than top surfaces of the isolation regions; a germanium-containing semiconductor region overlapped by the silicon fin; silicon oxide regions on opposite sides of the germanium-containing semiconductor region; and a first germanium-containing semiconductor layer between and in contact with the silicon fin and one of the silicon oxide regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit structure comprising:
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a semiconductor substrate; isolation regions extending into the semiconductor substrate, wherein the isolation regions comprise opposite sidewalls facing each other; and a fin structure comprising; a silicon fin higher than top surfaces of the isolation regions; a silicon strip between the opposite sidewalls of the isolation regions, wherein sidewalls of the silicon strip are in contact with the opposite sidewalls of the isolation regions; a germanium-containing semiconductor region between aligned to the silicon fin and the silicon strip; a first and a second silicon oxide region on opposite sides of the germanium-containing semiconductor region; a first germanium-containing semiconductor layer between and in contact with the silicon fin and the first silicon oxide region; a second germanium-containing semiconductor layer between and in contact with the silicon fin and the second silicon oxide region; a third germanium-containing semiconductor layer between and in contact with the silicon strip and the first silicon oxide region; and a fourth germanium-containing semiconductor layer between and in contact with the silicon strip and the second silicon oxide region. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. An integrated circuit structure comprising:
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a semiconductor substrate; isolation regions extending into the semiconductor substrate, wherein the isolation regions comprise opposite sidewalls facing each other; and a fin structure comprising; a silicon fin higher than top surfaces of the isolation regions; a germanium-containing semiconductor region; and a silicon oxide region comprising; a first and a second portion on opposite sides of the germanium-containing semiconductor region; and a top portion connecting the first portion to the second portion, wherein the top portion fully separates the germanium-containing semiconductor region from the silicon fin. - View Dependent Claims (18, 19, 20)
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Specification