PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
First Claim
1. A photosensitive imager device, comprising:
- a plurality of semiconductor devices including semiconductor substrates having a light incident side and multiple doped regions forming at least one junction;
a textured region coupled to the light incident side of the semiconductor substrate and positioned to interact with electromagnetic radiation; and
at least one isolation feature operable to isolate the plurality of semiconductor devices from each other.
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Accused Products
Abstract
Backside illuminated photosensitive devices and associated methods are provided. In one aspect, for example, a backside-illuminated photosensitive imager device can include a semiconductor substrate having multiple doped regions forming a least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, and a passivation region positioned between the textured region and the at least one junction. The passivation region is positioned to isolate the at least one junction from the textured region, and the semiconductor substrate and the textured region are positioned such that incoming electromagnetic radiation passes through the semiconductor substrate before contacting the textured region. Additionally, the device includes an electrical transfer element coupled to the semiconductor substrate to transfer an electrical signal from the at least one junction.
52 Citations
17 Claims
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1. A photosensitive imager device, comprising:
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a plurality of semiconductor devices including semiconductor substrates having a light incident side and multiple doped regions forming at least one junction; a textured region coupled to the light incident side of the semiconductor substrate and positioned to interact with electromagnetic radiation; and at least one isolation feature operable to isolate the plurality of semiconductor devices from each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification