MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE
First Claim
1. A microelectronic assembly, comprising:
- a heat spreader having a first major surface and a second major surface opposite the first major surface;
at least one die located with respect to the first major surface of the heat spreader and thermally coupled to at least a portion of the heat spreader;
at least one other die located with respect to the second major surface of the heat spreader and thermally coupled to at least a portion of the heat spreader;
an opening in the heat spreader, the opening located in a region of the heat spreader between the at least one die and the at least one other die;
an insulator located in the opening; and
electrically conductive material located in an electrically insulated through hole in the insulator,wherein the insulator electrically isolates the electrically conductive material and the heat spreader from each other.
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Accused Products
Abstract
A microelectronic assembly (100) and a microelectronic device (4100) include a stacked structure (101). The stacked structure includes a heat spreader (104), at least one die (106) thermally coupled to at least a portion of one side of the heat spreader, at least one other die (108) thermal coupled to at least a portion of an opposite side of the heat spreader, at least one opening (401) in the heat spreader located in a region of between the two die, an insulator (603) disposed in the at least one opening, and electrically conductive material (1308, 1406) in an insulated hole (705) in the insulator. The heat spreader allows electrical communication between the two die through the opening while the insulator isolates the electrically conductive material and the heat spreader from each other.
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Citations
20 Claims
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1. A microelectronic assembly, comprising:
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a heat spreader having a first major surface and a second major surface opposite the first major surface; at least one die located with respect to the first major surface of the heat spreader and thermally coupled to at least a portion of the heat spreader; at least one other die located with respect to the second major surface of the heat spreader and thermally coupled to at least a portion of the heat spreader; an opening in the heat spreader, the opening located in a region of the heat spreader between the at least one die and the at least one other die; an insulator located in the opening; and electrically conductive material located in an electrically insulated through hole in the insulator, wherein the insulator electrically isolates the electrically conductive material and the heat spreader from each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a microelectronic device, comprising:
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providing a heat spreader having a first major surface and a second major surface opposite the first major surface, wherein the heat spreader has an opening, an insulator in the opening, an electrically insulated through hole in the insulator, and electrically conductive material in the electrically insulated through hole; providing a first die and a second die, each die having a through via and an electrically conductive substance therein; thermally coupling the first die to at least a portion of the first major surface of the heat spreader, the portion including the opening, wherein the first die is located with respect to the first major surface of the heat spreader; and thermally coupling the second die to at least a portion of the second major surface of the heat spreader, the portion including the opening, wherein the second die is located with respect to the second major surface of the heat spreader, wherein the electrically conductive material in the electrically insulated through hole of the heat spreader is coupled to the electrically conductive substance in the through via of the at least one die and to the electrically conductive substance in the through via of the at least one other die. - View Dependent Claims (13, 14, 15, 16)
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17. A method of manufacturing a microelectronic assembly, comprising:
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providing a first die having at least one through via, the at least one through via having an electrically insulating lining and an electrically conductive substance therein, wherein a thermally conductive material is located on a surface of the first die and thermally coupled to the first die, the thermally conductive material defining an opening in the thermally conductive material, and wherein a dielectric material is located in the opening, the dielectric material defining a hole in the dielectric material, the hole including an electrically conductive material; and thermally coupling a second die to the thermally conductive material located on the surface of the first die, the second die having at least one through via, the at least one having an electrically insulating lining, the at least one through via having an electrically conductive substance within the electrically insulating lining, wherein the electrically conductive material in the hole is electrically coupled to the electrically conductive substance in the through via of the first die and to the electrically conductive substance in the through via of the second die. - View Dependent Claims (18, 19, 20)
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Specification