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MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE

  • US 20140197541A1
  • Filed: 01/15/2013
  • Published: 07/17/2014
  • Est. Priority Date: 01/15/2013
  • Status: Active Grant
First Claim
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1. A microelectronic assembly, comprising:

  • a heat spreader having a first major surface and a second major surface opposite the first major surface;

    at least one die located with respect to the first major surface of the heat spreader and thermally coupled to at least a portion of the heat spreader;

    at least one other die located with respect to the second major surface of the heat spreader and thermally coupled to at least a portion of the heat spreader;

    an opening in the heat spreader, the opening located in a region of the heat spreader between the at least one die and the at least one other die;

    an insulator located in the opening; and

    electrically conductive material located in an electrically insulated through hole in the insulator,wherein the insulator electrically isolates the electrically conductive material and the heat spreader from each other.

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