PRINTED CIRCUIT BOARD AND MAGNETIC FIELD OR CURRENT SENSOR
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Accused Products
Abstract
A printed circuit has a creep suppressor and a stack of metallization layers separated by electrically insulating layers. A metallization layer arranged above the insulating layer at least partially covers a cavity formed in the latter'"'"'s top face. Prepreg arranged directly on the insulating layer below the metallization layer bonds the layers together. A magnetic core is housed in the cavity leaves at least a five micrometer gap between the cavity'"'"'s vertical walls and roof and the core'"'"'s facing vertical and top faces. During stack assembly, the creep suppressor prevents prepreg from flowing, by creep, into the cavity until it contacts more than 20% of the core'"'"'s top face.
63 Citations
20 Claims
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1-10. -10. (canceled)
- 11. An apparatus comprising a printed circuit, said printed circuit comprising a creep suppressor, a magnetic core, and a stack, wherein said stack comprises an insulating layer, a metallization layer, and prepreg, wherein said stack comprises metallization layers stacked in a vertical direction, wherein said stack comprises electrically insulating layers, wherein said metallization layers are separated from each other by said electrically insulating layers, wherein an insulating layer comprises a hollowed-out cavity formed in a top face thereof, wherein a metallization layer is arranged above said insulating layer, wherein said metallization layer at least partially covers said cavity, wherein said prepreg is arranged directly on said insulating layer, wherein said prepreg is arranged below said metallization layer, wherein said prepreg bonds said layers together with no degree of freedom during assembly thereof, wherein said magnetic core has a length and a width, wherein said length is greater than said width, wherein said magnetic core is housed inside said cavity, wherein said magnetic core has transversal dimensions that are smaller than corresponding transversal dimensions of said cavity, wherein a gap of at least five micrometers exists between vertical walls and a roof of said cavity and facing vertical and top faces of said magnetic core, and wherein said creep suppressor prevents said prepreg from flowing, by creep, during assembly of said insulating and metallization layers, into said cavity until said prepreg comes into direct contact with said magnetic core over more than twenty percent of a surface of said top face of said magnetic core.
- 19. A method for fabricating a printed circuit comprising a stack comprises vertically stacked metallization layers mechanically separated from one another by electrically insulating layers, said method comprising hollowing out a cavity in a top face of an insulating layer, inserting, into said cavity, a magnetic core having a length and a width, said length being greater than said width, said magnetic core having been fabricated independently of said insulating layer, said magnetic core having transversal dimensions that are smaller than corresponding transversal dimensions of said cavity so as to form a gap of at least five micrometers between vertical walls and a roof of said cavity and facing vertical and top faces of said magnetic core, depositing a metallization layer above said insulating layer, said metallization layer at least partially covering said cavity, and assembling said layers, wherein assembling said layers comprises directly depositing a prepreg on said insulating layer and below said metallization layer, bonding using said prepreg, and preventing flow by creep into said cavity until said prepreg comes into direct contact with said magnetic core over more than twenty percent of a surface of a top face of said magnetic core during assembly of said insulating and metallization layers
Specification