WAVELENGTH CONVERSION CHIP FOR A LIGHT EMITTING DIODE, AND METHOD FOR MANUFACTURING SAME

• US 20140198528A1
• Filed: 08/17/2011
• Published: 07/17/2014
• Est. Priority Date: 08/17/2011
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Je Won, Lee, Jong Ho, Chae, Seung Wan, KIim, Yong Tae, Inoue, Tomio, Tsutsui, Tsuyoshi
• Application Number:
  US14/239,100
• Publication Number:
  US 20140198528A1
• Time in Patent Office: Days
• US Class Current: 362/612
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

There is provided a method of manufacturing a wavelength converted LED chip, including attaching a plurality of LED chips to a chip alignment region of an upper surface of a temporary support plate, forming a conductive bump on the electrode of the respective LED chips, forming a phosphor-containing resin encapsulation part in the chip alignment region to cover the conductive bump, polishing the phosphor containing resin encapsulation part, forming the wavelength converted LED chips by cutting the provided phosphor containing resin encapsulation part between the LED chips, the wavelength converted LED chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted LED chip, and removing the temporary support plate from the wavelength converted LED chip.

Claims

1. A method of manufacturing a wavelength converted light emitting diode (LED) chip, comprising:

attaching a plurality of LED chips to a chip alignment region of an upper surface of a temporary support plate such that a surface thereof on which at least one electrode is formed is directed in an upper direction;

forming a conductive bump on the electrode of the respective LED chips;

forming a phosphor-containing resin encapsulation part in the chip alignment region so as to cover the conductive bump;

polishing the phosphor containing resin encapsulation part;

forming the wavelength converted LED chips by cutting the provided phosphor containing resin encapsulation part between the LED chips, the wavelength converted LED chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted LED chip; and

removing the temporary support plate from the wavelength converted LED chip.

2. The method of claim 1, wherein the plurality of LED chips are obtained from at least one wafer and selected by a criterion of specific emitted light characteristics.

3. The method of claim 2, wherein the emitted light characteristics are at least one of a peak wavelength of emitted light and an output of light.

4. The method of claim 1, wherein the temporary support plate includes a dam structure encompassing the chip alignment region.

5. The method of claim 4, wherein the dam structure has a height at least greater than that of a chip including the conductive bumps formed therein.

6. The method of claim 1, wherein a distance between the LED chips attached to the temporary support substrate is greater than a distance twice a thickness of a portion of a light wavelength conversion layer to be located on lateral surfaces of the LED chip.

7. The method of claim 1, wherein the temporary support plate is an ultraviolet (UV) curable polyethyleneterephtalate (PET) film.

8. The method of claim 1, wherein the forming of the phosphor containing resin encapsulation part is performed through a process selected from a dispensing method, a screen printing method, a spin coating method, a spray coating method and a transfer molding method.

9. The method of claim 1, wherein the plurality of LED chips include an insulating substrate, a semiconductor epitaxial layer including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer sequentially formed on the insulating substrate, and first and second electrodes respectively formed on the first and second conductive semiconductor layers.

10. The method of claim 1, wherein the plurality of LED chips include a conductive substrate, a semiconductor epitaxial layer including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer sequentially formed on the conductive substrate, and an electrode formed on the second conductive semiconductor layer.

14. A light emitting device package comprising the wavelength converted LED chip manufactured through the method of claim 1.

15. A surface light source device comprising:

a light guide plate; and

an LED light source module formed on at least one side of the light guide plate to provide light to an inside of the light guide plate,

wherein the LED light source module includes a circuit board and an LED light source mounted on the circuit board and having the wavelength converted LED chip manufactured through the method of claim 1.

16. A display device comprising:

an image display panel providing an image; and

a backlight unit including the surface light source device of claim 15 providing light to the image display panel.

17. An illumination device comprising:

an LED light source module; and

a diffusion sheet formed on the LED light source module and allowing light incident from the LED light source module to be uniformly diffused thereon,

wherein the LED light source module includes a circuit board and an LED light source mounted on the circuit board and having the wavelength converted LED chip manufactured through the method of claim 1.

11-13. -13. (canceled)