METHOD AND STRUCTURE FOR ADDING MASS WITH STRESS ISOLATION TO MEMS STRUCTURES
First Claim
1. A method for fabricating a proof mass apparatus, the method comprising:
- providing a thickness of silicon material coupled to at least one flexible element, the thickness of silicon material being configured to move in one or more spatial directions about the flexible element(s);
forming a proof mass configured from a plurality of recessed regions in respective spatial regions of the thickness of silicon material;
forming a glue material within each of the recessed regions; and
forming a plug material overlying each of the recessed regions.
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Abstract
A method and structure for adding mass with stress isolation to MEMS. The structure has a thickness of silicon material coupled to at least one flexible element. The thickness of silicon material can be configured to move in one or more spatial directions about the flexible element(s) according to a specific embodiment. The apparatus also includes a plurality of recessed regions formed in respective spatial regions of the thickness of silicon material. Additionally, the apparatus includes a glue material within each of the recessed regions and a plug material formed overlying each of the recessed regions.
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Citations
20 Claims
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1. A method for fabricating a proof mass apparatus, the method comprising:
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providing a thickness of silicon material coupled to at least one flexible element, the thickness of silicon material being configured to move in one or more spatial directions about the flexible element(s); forming a proof mass configured from a plurality of recessed regions in respective spatial regions of the thickness of silicon material; forming a glue material within each of the recessed regions; and forming a plug material overlying each of the recessed regions. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification