DEPOSITION APPARATUS

• US 20140202382A1
• Filed: 01/17/2014
• Published: 07/24/2014
• Est. Priority Date: 01/21/2013
• Status: Abandoned Application

• Current Assignee: ASM IP Holding B.V. (ASM International NV)
• Original Assignee: ASM IP Holding B.V. (ASM International NV)
• Inventors: Choi, Seung Woo, KIM, Young-Jae, Kim, Ki Jong, Jung, Dong-Rak, Kwon, Hak Yong
• Application Number:
  US14/157,626
• Publication Number:
  US 20140202382A1
• Time in Patent Office: Days
• US Class Current: 118/500
• CPC Class Codes: C23C 16/4401 Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
• CPC Class Codes: C23C 16/4586 Elements in the interior of the support, e.g. electrodes, heating or cooling devices
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins

Abstract

A deposition apparatus is provided to eliminate unnecessary empty spaces that may form between a substrate and a substrate supporting pin, which may be formed within a substrate supporting pin hole, by covering the substrate supporting pin, inserted into the substrate supporting pin hole formed in the substrate support, by a substrate supporting pin cover loaded on the substrate support. Accordingly, the temperature under the substrate can be maintained constant, and generation of parasitic plasma or contaminating particles can be avoided.

Claims

1. A deposition apparatus comprising:

a substrate support;

a substrate supporting pin inserted into a hole formed in the substrate support;

a supporting plate supporting the substrate supporting pin; and

a supporting pin cover arranged on top of the substrate supporting pin within the hole of the substrate support.

2. The deposition apparatus of claim 1, wherein an upper surface of the supporting pin cover is almost the same height as an upper surface of the supporting plate.

3. The deposition apparatus of claim 2, wherein the upper surface of the supporting pin cover has almost the same cross-sectional area as the hole.

4. The deposition apparatus of claim 3, wherein the supporting pin cover comprises a lower body located under the upper surface of the supporting pin cover and shaped to form an insertion hole, and the insertion hole has almost the same cross-sectional area as the substrate supporting pin.

5. The deposition apparatus of claim 4, wherein:

an upper surface of the substrate supporting pin is concave or convex, and

the insertion hole of the supporting pin cover is convex or concave so as to engage with a concavity or convexity on the upper surface of the substrate supporting pin.

6. The deposition apparatus of claim 4, wherein:

a coupling slot having a smaller cross-sectional area than the substrate supporting pin is formed in the upper surface of the substrate supporting pin, and

a coupling projection having almost the same cross-sectional area as the coupling slot is formed on a lower surface of the supporting pin cover.

7. The deposition apparatus of claim 4, wherein:

the substrate support comprises a projecting portion, and

the projecting portion takes the form of a plate-like circle surrounding the supporting pin cover in a circle or the form of a plurality of protuberances arranged around the supporting pin cover.

8. The deposition apparatus of claim 3, wherein:

a coupling projection having a smaller cross-sectional area than the substrate supporting pin is formed on an upper surface of the substrate supporting pin, and

a coupling slot having almost the same cross-sectional area as the coupling projection is formed in a lower surface of the supporting pin cover.

9. The deposition apparatus of claim 3, wherein the supporting pin cover comprises a lower surface having almost the same cross-sectional area as the hole.

10. The deposition apparatus of claim 3, wherein a plurality of through holes are formed in the upper surface of the supporting pin cover.

11. The deposition apparatus of claim 3, wherein:

the substrate support comprises a projecting portion, and

the projecting portion takes the form of a plate-like circle surrounding the supporting pin cover in a circle or the form of a plurality of protuberances arranged around the supporting pin cover.

12. The deposition apparatus of claim 2, wherein the supporting pin cover comprises a lower body located under the upper surface of the supporting pin cover and shaped to form an insertion hole, and the insertion hole has almost the same cross-sectional area as the substrate supporting pin.

13. The deposition apparatus of claim 12, wherein:

an upper surface of the substrate supporting pin is concave or convex, and

the insertion hole of the supporting pin cover is convex or concave so as to engage with a concavity or convexity on the upper surface of the substrate supporting pin.

14. The deposition apparatus of claim 12, wherein:

a coupling slot having a smaller cross-sectional area than the substrate supporting pin is formed in an upper surface of the substrate supporting pin, and

a coupling projection having almost the same cross-sectional area as the coupling slot is formed on a lower surface of the supporting pin cover.

15. The deposition apparatus of claim 2, wherein:

a coupling projection having a smaller cross-sectional area than the substrate supporting pin is formed on an upper surface of the substrate supporting pin, and

a coupling slot having almost the same cross-sectional area as the coupling projection is formed in a lower surface of the supporting pin cover.

16. The deposition apparatus of claim 2, wherein the supporting pin cover comprises a lower surface having almost the same cross-sectional area as the hole.

17. The deposition apparatus of claim 2, wherein a plurality of through holes are formed in the upper surface of the supporting pin cover.

18. The deposition apparatus of claim 2, wherein:

the substrate support comprises a projecting portion, and

the projecting portion takes the form of a plate-like circle surrounding the supporting pin cover in a circle or the form of a plurality of protuberances arranged around the supporting pin cover.