MULTILAYER SUBSTRATE MODULE

• US 20140202750A1
• Filed: 01/07/2014
• Published: 07/24/2014
• Est. Priority Date: 01/21/2013
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: KITAJIMA, Hiromichi, KOGURE, Takeshi
• Granted Patent: US 9,119,318 B2
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0792 Means against parasitic impedance; Means against eddy currents
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/0969 Apertured conductors

Abstract

A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by conductor patterns. The area where inductor is located is not superposed with the area where the second ground conductor is located, when the one main surface or the other main surface of the multilayer circuit substrate is viewed in plan, the second ground conductor being closer to the layer where the inductor is located than the first ground conductor is.

Claims

1. (canceled)

2. A multilayer substrate module comprising:

a multilayer circuit substrate including a plurality of layers stacked on top of one another in a stacking direction and including conductor patterns located on the layers;

a first external connection terminal located on one main surface of the multilayer circuit substrate; and

a second external connection terminal located on another main surface of the multilayer circuit substrate;

wherein

a wiring line that connects the first external connection terminal and the second external connection terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are defined by the conductor patterns inside the multilayer circuit substrate; and

an area where the inductor is located is not superposed with an area where one of the first ground conductor and the second ground conductor that is closer to the layer including the inductor is located when the multilayer circuit substrate is viewed in plan.

3. The multilayer substrate module according to claim 2, wherein the area where the inductor is located is superposed with at least one of the area where the first external connection terminal is located and the area where the second external connection terminal is located when the multilayer circuit substrate is viewed in plan.

4. The multilayer substrate module according to claim 2, wherein an opening is arranged in the ground conductor such that the area where the ground conductor is located is not superposed with the area where the inductor is located when the multilayer circuit substrate is viewed in plan.

5. The multilayer substrate module according to claim 2, wherein

a first portion of the inductor defines a first inductor and a second portion of the inductor defines a second inductor;

the first inductor is located in an area that is not superposed with the second inductor when the multilayer circuit substrate is viewed in plan.

6. The multilayer substrate module according to claim 2, wherein the area where the inductor is located is not superposed with either of the area where the first ground conductor is located and the area where the second ground conductor is located when the multilayer circuit substrate is viewed in plan.

7. The multilayer substrate module according to claim 2, wherein the inductor is connected in series with the first external connection terminal.

8. The multilayer substrate module according to claim 2, wherein the inductor connects the wiring line to the first ground conductor or the second ground conductor.

9. The multilayer substrate module according to claim 2, wherein the first external connection terminal includes a mounting land and the second external connection terminal includes an input/output terminal.

10. The multilayer substrate module according to claim 2, further comprising a switch IC mounted on the multilayer circuit substrate.

11. The multilayer substrate module according to claim 10, wherein the switch IC includes an antenna connection port that is connected to an antenna and a plurality of high-frequency input/output ports.

12. The multilayer substrate module according to claim 2, wherein the inductor shunt-connects the wiring line to the first ground conductor.

13. The multilayer substrate module according to claim 2, wherein the second ground conductor does not face the inductor.

14. The multilayer substrate module according to claim 9, wherein the input/output terminal is spaced apart from the inductor in the multilayer circuit substrate.

15. The multilayer substrate module according to claim 2, wherein the wiring line extends from a top surface of the multilayer circuit substrate to a location below a center of the multilayer circuit substrate in the stacking direction.

16. The multilayer substrate module according to claim 15, wherein the wiring line is located in a central portion of the multilayer circuit substrate in a width direction of the multilayer circuit substrate that is perpendicular to the stacking direction.

17. The multilayer substrate module according to claim 2, wherein the wiring line extends from a bottom surface of the multilayer circuit substrate to a location above a center of the multilayer circuit substrate in the stacking direction.

18. The multilayer substrate module according to claim 17, wherein the wiring line is located to one side of a central portion of the multilayer circuit substrate in a width direction of the multilayer circuit substrate that is perpendicular to the stacking direction.

19. The multilayer substrate module according to claim 2, wherein the wiring line extends in a direction that is parallel or substantially parallel to the stacking direction.

20. The multilayer substrate module according to claim 2, wherein the wiring line extends in a direction that is perpendicular or substantially perpendicular to the stacking direction.