LIGHT EMITTING DEVICE AND ITS METHOD OF MANUFACTURE
First Claim
1. A light emitting device comprising:
- a substrate;
semiconductor light emitting elements mounted on the substrate;
a mold frame that surrounds the periphery of the light emitting elements on the substrate; and
resin layers that fill the inside of the mold frame,wherein the mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame,wherein the resin layers comprises;
a first resin layer that embeds the light emitting elements in resin and is formed with a height approximately equal to the height of the top of the first mold frame; and
a second resin layer formed on top of the first resin layer with a height approximately equal to the height of the top of the second mold frame, andwherein wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements is included in at least one of the resin layers, which are the first resin layer and the second resin layer.
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Accused Products
Abstract
The light emitting device is provided with a substrate, semiconductor light emitting elements mounted on the substrate, a mold frame that surrounds the periphery of the light emitting elements on the substrate, and resin layers that fill the inside of the mold frame. The mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame. The resin layers include a first resin layer that embeds the light emitting elements in resin and is formed with a height approximately equal to the height of the top of the first mold frame, and a second resin layer on top of the first resin layer that is formed with a height approximately equal to the height of the top of the second mold frame. At least one of the resin layers (which are the first resin layer and the second resin layer) includes wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements.
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Citations
17 Claims
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1. A light emitting device comprising:
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a substrate; semiconductor light emitting elements mounted on the substrate; a mold frame that surrounds the periphery of the light emitting elements on the substrate; and resin layers that fill the inside of the mold frame, wherein the mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame, wherein the resin layers comprises; a first resin layer that embeds the light emitting elements in resin and is formed with a height approximately equal to the height of the top of the first mold frame; and a second resin layer formed on top of the first resin layer with a height approximately equal to the height of the top of the second mold frame, and wherein wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements is included in at least one of the resin layers, which are the first resin layer and the second resin layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A light emitting device comprising:
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a substrate; semiconductor light emitting elements mounted on the substrate; a mold frame that surrounds the periphery of the light emitting elements on the substrate; and resin layers that fill the inside of the mold frame, wherein the mold frame includes a first mold frame, and a second mold frame formed on top of the first mold frame, wherein the resin layers fill the inside of the mold frame made up of the first mold frame and the second mold frame, and wherein wavelength-shifting material to change the wavelength of light emitted from the semiconductor light emitting elements is included in the resin layers.
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15. A method of manufacturing a light emitting device, the light emitting device comprising:
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a substrate; semiconductor light emitting elements mounted on the substrate; a mold frame that surrounds the periphery of the light emitting elements mounted on the substrate; and resin layers that fill the encapsulating region established inside the mold frame, the method comprising; forming a first mold frame on top of the substrate; filling the encapsulating region inside the first mold frame with a first resin to a height approximately equal to the top of the first mold frame in a manner that encapsulates the light emitting elements mounted in the encapsulating region; forming a second mold frame covering at least part of the first mold frame after solidifying the first resin to form a first resin layer; filling the inside the second mold frame with a second resin to a height approximately equal to the top of the second mold frame; and solidifying the second resin to form a second resin layer. - View Dependent Claims (17)
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16. A method of manufacturing a light emitting device, the method comprising:
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preparing a substrate with conducting material disposed on top of an insulating planar surface; mounting semiconductor light emitting elements on the substrate in a manner making electrical connection with the conducting material, and to form a first mold frame around the periphery of the light emitting elements; forming a first resin layer in the region established inside the first mold frame; forming a second mold frame over the upper surface of the first mold frame; and forming a second resin layer in the region established by the second mold frame.
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Specification