ELECTRONIC PACKAGE, FABRICATION METHOD THEREOF AND ADHESIVE COMPOUND

• US 20140203771A1
• Filed: 08/06/2013
• Published: 07/24/2014
• Est. Priority Date: 01/18/2013
• Status: Abandoned Application

• Current Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Hsu, Tsung-Hsien, Chung, Hsin-Lung, Chu, Te-Fang, Chen, Chia-Yang, Lam, Kwok-Yan
• Application Number:
  US13/960,033
• Publication Number:
  US 20140203771A1
• Time in Patent Office: Days
• US Class Current: 320/108
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/402 the two or more transmitting or the two or more receiving devices being integrated in the same unit, e.g. power mats with several coils or antennas with several sub-antennas
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 7/0044 specially adapted for holding portable devices containing batteries H02J7/0045 takes precedence
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

An electronic package is provided, which includes: a substrate, a charging module and a coil module disposed on the substrate, and an encapsulant formed on the substrate for encapsulating the charging module and the coil module. The coil module has a plurality of coils having an opening, an adhesive compound formed on the coils in a manner that the opening of the coils is exposed from the adhesive compound, and a magnet inserted in the opening of the coils. Further, the adhesive compound comprises a metal oxide. Compared with the conventional ferrite, the adhesive compound is flexible and not easy to crack or break during transportation or assembly, thereby greatly improving the charging efficiency of the electronic package.

Claims

1. An electronic package, comprising:

a substrate;

a charging module disposed on the substrate;

a coil module disposed on the substrate, and having coils having an opening, an adhesive compound formed on the coils in a manner that the opening of the coils is exposed from the adhesive compound, and a magnet inserted in the opening of the coils, wherein the adhesive compound comprises a metal oxide; and

an encapsulant formed on the substrate for encapsulating the charging module and the coil module.

2. The package of claim 1, wherein the substrate has contact terminals electrically connected to the charging module.

3. The package of claim 2, wherein the contact terminals are exposed from the encapsulant.

4. The package of claim 1, wherein the metal oxide is at least one selected from the group consisting of iron oxide, manganese oxide and zinc oxide.

5. The package of claim 4, wherein the iron oxide is Fe₂O₃.

6. The package of claim 4, wherein the manganese oxide is Mn₃O₄.

7. The package of claim 4, wherein the zinc oxide is ZnO.

8. The package of claim 1, wherein the adhesive compound is further formed on the charging module.

9. A fabrication method of an electronic package, comprising the steps of:

providing a substrate having a charging module and a plurality of coils disposed thereon, wherein an opening is formed in the coils;

forming an adhesive compound on the coils in a manner that the opening of the coils is exposed from the adhesive compound, wherein the adhesive compound comprises a metal oxide;

inserting a magnet in the opening of the coils such that the magnet, the coils and the adhesive compound form a coil module; and

forming an encapsulant on the substrate for encapsulating the charging module and the coil module.

10. The method of claim 9, wherein the substrate has a contact terminal electrically connected to the charging module.

11. The method of claim 10, wherein the contact terminal is exposed from the encapsulant.

12. The method of claim 9, wherein the metal oxide is at least one selected from the group consisting of iron oxide, manganese oxide and zinc oxide.

13. The method of claim 12, wherein the iron oxide is Fe₂O₃.

14. The method of claim 12, wherein the manganese oxide is Mn₃O₄.

15. The method of claim 12, wherein the zinc oxide is ZnO.

16. The method of claim 9, further comprising forming the adhesive compound on the charging module.

17. The method of claim 9, further comprising curing the adhesive compound.

18. An adhesive compound, comprising:

an epoxy resin; and

at least a metal oxide selected from the group consisting of iron oxide, manganese oxide and zinc oxide.

19. The compound of claim 18, wherein the iron oxide is Fe₂O₃.

20. The compound of claim 18, wherein the manganese oxide is Mn₃O₄.

21. The compound of claim 18, wherein the zinc oxide is ZnO.