CIRCUIT BOARD ASSEMBLY

• US 20140204551A1
• Filed: 01/22/2014
• Published: 07/24/2014
• Est. Priority Date: 01/22/2013
• Status: Abandoned Application

• Current Assignee: Baumueller Nuernberg Gmbh
• Original Assignee: Baumueller Nuernberg Gmbh
• Inventors: GRUNERT, Rainer, HENSEL, Uwe
• Application Number:
  US14/160,974
• Publication Number:
  US 20140204551A1
• Time in Patent Office: Days
• US Class Current: 361/768
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/145 Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A circuit board assembly with a printed circuit board, which has an SMD mounting location for attaching a first integrated circuit having an electrical circuit. A replacement circuit board having the electrical circuit is soldered at the SMD mounting location using SMD technology.

Claims

1. A circuit board assembly with a printed circuit board, which has an SMD mounting location for attaching a first integrated circuit having an electrical circuit, whereby a replacement circuit board having the electrical circuit is soldered at the SMD mounting location using SMD technology, the replacement circuit board being electrically contacted via an electronic component with the SMD mounting location, the electronic component being a surface-mounted device, the electronic component being a capacitor, and the electrodes of the capacitor being short-circuited.

2. The circuit board assembly according to claim 1, wherein the replacement circuit board comprises a second integrated circuit having the electrical circuit.

3. The circuit board assembly according to claim 2, wherein the second integrated circuit is arranged on a side facing away from the circuit board of the replacement circuit board.

4. The circuit board assembly according to claim 2, wherein the second integrated circuit is a surface-mounted element.

5. The circuit board assembly according to claim 2, wherein the second integrated circuit has a package in an SO format or an SO8 format.

6. The circuit board assembly according to claim 5, wherein the electronic component is a chip, particularly 0603, 0402, 0201, or 01005.

7. The circuit board assembly according to claim 1, wherein the replacement circuit board is spaced apart at least in sections from the circuit board or the replacement circuit board is parallel to the circuit board.

8. The circuit board assembly according to claim 1, wherein the replacement circuit board comprises a stripboard with a number of lands, which are electrically isolated from one another.