CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING THE SAME

• US 20140205128A1
• Filed: 01/23/2013
• Published: 07/24/2014
• Est. Priority Date: 01/23/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Spoettl, Thomas, Theuss, Horst
• Granted Patent: US 10,097,918 B2
• Time in Patent Office: Days
• US Class Current: 381/369
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 3/00 Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

Claims

1. A method for manufacturing a chip arrangement, the method comprising:

bonding a microphone chip to a first carrier, the microphone chip comprising a microphone structure;

depositing adhesive material laterally disposed from the microphone structure; and

arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

2. The method of claim 1,

wherein bonding the microphone chip to the first carrier comprises a flip chip on substrate process.

3. The method of claim 1, further comprising:

bonding a further chip to the first carrier, wherein the further chip is electrically coupled to the microphone chip.

4. The method of claim 3,

wherein the further chip is electrically coupled to the microphone chip via the first carrier.

5. The method of claim 3,

wherein the further chip is electrically coupled to the microphone chip via wire bonds.

6. The method of claim 3,

wherein the further chip comprises a logic chip.

7. The method of claim 3,

wherein the further chip comprises an application specific integrated circuit chip.

8. The method of claim 3,

wherein the further chip is configured to carry out signal processing of one or more signals received from the microphone chip.

9. The method of claim 1,

wherein the microphone structure comprises at least one membrane configured to receive sound waves.

10. The method of claim 1,

wherein the adhesive material comprises hot melting material.

11. The method of claim 1,

wherein the microphone structure is arranged into the cavity of the second carrier so that the adhesive material form an acoustic seal between the first carrier and the second carrier.

12. The method of claim 1,

wherein the adhesive material is deposited after the microphone chip has been bonded to the first carrier.

13. The method of claim 1,

wherein the arranging the microphone structure into the cavity of the second carrier comprises pressing the first carrier into the cavity of the second carrier.

14. The method of claim 13,

wherein the pressing is carried out using a pressure force in the range from about 50 N to about 150 N, at a temperature in the range from about 150°

C. to about 250°

C.

15. A chip arrangement, comprising:

a first carrier;

a microphone chip bonded to the first carrier, the microphone chip comprising a microphone structure;

adhesive material laterally disposed from the microphone structure; and

a second carrier comprising a cavity;

wherein the microphone structure is arranged in the cavity of the second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

16. The chip arrangement of claim 15,

wherein the microphone chip is bonded to the first carrier via a flip chip bonding.

17. The chip arrangement of claim 15, further comprising:

a further chip bonded to the first carrier, wherein the further chip is electrically coupled to the microphone chip.

18. The chip arrangement of claim 17,

wherein the further chip is electrically coupled to the microphone chip via the first carrier.

19. The chip arrangement of claim 17,

wherein the further chip is electrically coupled to the microphone chip via wire bonds.

20. The chip arrangement of claim 17,

wherein the further chip comprises a logic chip.

21. The chip arrangement of claim 17,

wherein the further chip is configured to carry out signal processing of one or more signals received from the microphone chip.

22. The chip arrangement of claim 15,

wherein the microphone structure comprises at least one membrane configured to receive sound waves.

23. The chip arrangement of claim 15,

wherein the adhesive material comprises hot melting material.

24. The chip arrangement of claim 15,

wherein the adhesive material is disposed with a layer thickness in the range from about 30 μ

m to about 150 μ

m.

25. The chip arrangement of claim 15,

wherein the microphone structure is arranged into the cavity of the second carrier so that the adhesive material form an acoustic seal between the first carrier and the second carrier.