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LIGHT EMITTING DIODE PACKAGE MODULE

  • US 20140209950A1
  • Filed: 01/30/2014
  • Published: 07/31/2014
  • Est. Priority Date: 01/31/2013
  • Status: Abandoned Application
First Claim
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1. A light emitting diode package module, comprising:

  • a substrate;

    a light emitting diode die disposed on the substrate;

    a transparent layer disposed on the light emitting diode die;

    a phosphor material layer disposed on the transparent layer; and

    a lens layer disposed on the phosphor material layer.

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