ALTERNATING CURRENT LIGHT EMITTING DIODE FLIP-CHIP

• US 20140209961A1
• Filed: 01/29/2014
• Published: 07/31/2014
• Est. Priority Date: 01/30/2013
• Status: Abandoned Application

• Current Assignee: Luxo-Led Co., Limited
• Original Assignee: Luxo-Led Co., Limited
• Inventors: TSO, Shih-Yang
• Application Number:
  US14/167,861
• Publication Number:
  US 20140209961A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13007 Bump connector smaller than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An alternating current light emitting diode flip chip is provided. The flip chip includes an alternating current light emitting diode chip having a first bond pad and a second bond pad formed thereon. A first solder ball is disposed on the first bond pad and a second solder ball is disposed on the second bond pad. A flip-chip bonding process is performed to bond a carrier substrate with the first solder ball and the second solder ball.

Claims

1. An alternating current light emitting diode flip-chip, comprising:

an alternating current light emitting diode chip;

a first bond pad disposed on the alternating current light emitting diode chip;

a second bond pad disposed on the alternating current light emitting diode chip;

a carrier substrate;

a first solder ball, disposed between the first bond pad and the carrier substrate; and

a second solder ball, disposed between the second bond pad and the carrier substrate.

2. The alternating current light emitting diode flip-chip according to claim 1, wherein a flip-chip bonding process is performed to bonding the carrier substrate and the alternating current light emitting diode chip.

3. The alternating current light emitting diode flip-chip according to claim 1, wherein the carrier substrate is a semiconductor substrate

4. The alternating current light emitting diode flip-chip according to claim 1, wherein the carrier substrate is a dielectric substrate.