LOW-COST PACKAGE FOR INTEGRATED MEMS SENSORS

• US 20140210019A1
• Filed: 01/30/2013
• Published: 07/31/2014
• Est. Priority Date: 01/30/2013
• Status: Abandoned Application

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: NASIRI, Steven S., TEA, Nim H., LLOYD, Stephen
• Application Number:
  US13/753,753
• Publication Number:
  US 20140210019A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An integrated MEMS sensor package is disclosed. The package comprises a sensor chip with a top surface and a bottom surface. The top surface comprises an opening. The bottom surface is attached to a substrate with electrical inter-connects. A lid is coupled to the top surface with an adhesive material. The lid may have an opening to expose the sensor chip to ambient environment.

Claims

1. A package comprising:

a sensor chip with a top surface and a bottom surface;

a substrate with electrical inter-connects, wherein the bottom surface is attached to the substrate; and

a lid coupled to the top surface with adhesive material.

2. The package of claim 1, wherein the lid has an opening to expose the sensor chip to ambient environment.

3. The package of claim 1, wherein the lid includes sidewalls, wherein a vertical gap is provided between the sidewalls and the substrate.

4. The package of claim 1, wherein the lid is not rigidly attached to the substrate.

5. The package of claim 1, wherein the vertical gap is filled with the adhesive material.

6. The package of claim 1, wherein the sensor chip comprises a plurality of integrated CMOS-MEMS sensors.

7. The package of claim 1, wherein adhesive material is a complaint low stress material.

8. The package of claim 7, wherein the low stress material is Room Temperature Vulcanizing (RTV) silicone elastomer.

9. The package of claim 1, further comprising a plurality of wire bond pads, the wire bond pads placed on at least one side of the sensor chip.

10. The package of claim 1, wherein the lid has an electrical connection to the substrate.

11. The package of claim 1, wherein the substrate comprises a multi-layer substrate.

12. The package of claim 1, where the substrate is formed as part of a strip comprising an array of N×

M packages and package pin connections are routed to the edge of the strip to allow connection to the package pins without direct pressure on the package surface wherein the pin connections are configured in a row and column in order to allow just one row or column of packages to be tested at a time.

13. The package of claim 1, where in the sensor chip comprises at least one MEMS die and at least one CMOS die.

14. The package of claim 13 further comprising plurality of CMOS dies and plurality of MEMS dies wherein the plurality of CMOS dies and plurality of MEMS dies are placed next to the sensor chip.

15. The package of claim 1, where in the sensor chip comprises plurality of CMOS die and plurality of MEMS die wherein the plurality of CMOS die and plurality of MEMS die are stacked.

16. A package of integrated sensor comprising:

a sensor chip;

a substrate with electrical inter-connects;

a first side of the sensor chip bonded to the substrate; and

a lid with no sidewalls bonded to a second side of the sensor chip;

wherein the lid has an opening to expose to ambient environment.

17. A method of packaging an integrated MEMS device, the method comprising:

attaching a sensor chip to a substrate;

the sensor chip having an opening in atop surface;

connecting sensor chip to the substrate with wire bonds to make electrical connection; and

bonding a lid to the top surface of the sensor chip such that the lid covers the sensor chip with a vertical gap between the lid and the substrate.

18. The method of claim 17, where the lid has an opening to expose a portion of the sensor chip to ambient environment.

19. A method of packaging an integrated MEMS device, the method comprising:

attaching a first surface of a sensor chip to a substrate using adhesive material;

connecting the sensor chip to the substrate with wire bonds to make electrical connection;

protecting the wire bonds with low stress material on sensor chip;

bonding a lid to a second surface of the sensor chip surface such that a vertical gap between the lid and the substrate.

20. The method of claim 19, where the lid has an opening to expose a portion of the MEMS die to ambient environment.

21. The method of claim 19, where in the bonding further comprises providing a path for ambient environment to the sensor chip.

22. A package comprising:

a MEMS die with a top surface and a bottom surface;

wherein the MEMS die has an opening located on the top surface;

a CMOS die with a top surface and a bottom surface;

a substrate with electrical inter-connects, wherein the MEMS die and the CMOS die are attached to the substrate in a side by side fashion, wherein the bottom surfaces of the MEMS die and the CMOS die are attached to the substrate;

wherein a path from the ambient environment to the opening of the MEMS die is provided.