SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• US 20140210067A1
• Filed: 09/03/2012
• Published: 07/31/2014
• Est. Priority Date: 09/28/2011
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Kodaira, Yoshihiro, Takamiya, Yoshikazu, Onishi, Kazunaga
• Granted Patent: US 9,171,768 B2
• Time in Patent Office: Days
• US Class Current: 257/698
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4911 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/049 the other leads being perpendicular to the base
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/19107 : off-chip wires

Abstract

A semiconductor device includes an insulating substrate joined with a semiconductor chip, a case covering a surface of the insulating substrate where the semiconductor chip is joined, and a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case. A portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal. The blocking section contacts the case from the outside of the case and blocks a movement of the control terminal.

Claims

1. A semiconductor device comprising:

an insulating substrate joined with a semiconductor chip;

a case covering a surface of the insulating substrate where the semiconductor chip is joined; and

a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case,

wherein a portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal, the blocking section contacting the case from the outside of the case and blocking a movement of the control terminal.

2. The semiconductor device according to claim 1, wherein the blocking section is configured to be accommodated inside the cut-out section when a pressure is applied in a direction of pressing the blocking section to a cut-out section side.

3. The semiconductor device according to claim 2, wherein the blocking section is configured to be accommodated inside the cut-out section by elasticity of a material constituting the blocking section when a pressure is applied in a direction of pressing the blocking section to the cut-out section side.

4. The semiconductor device according to claim 1, wherein the control terminal includes:

a through section having one end portion exposed to the outside of the case in which a portion exposed to the outside of the case is provided with the blocking section; and

a linking section linked to another end portion of the through section, and having a flat surface orthogonal to the through section and parallel to the insulating substrate.

5. The semiconductor device according to claim 4, wherein the case includes:

a lid disposed above the surface of the insulating substrate where the semiconductor chip is joined;

a through hole provided in the lid, through which the control terminal passes;

a step provided at a side section of the through hole from a surface side of the lid exposed to the outside of the case, and contacting the blocking section; and

a protrusion provided on a surface of the lid on an insulating substrate side and contacting the flat surface of the linking section.

6. The semiconductor device according to claim 5, wherein an opening width of the through hole has a dimension substantially equal to a width of a side surface of the control terminal passing through the through hole, the side surface facing the side section of the through hole.

7. The semiconductor device according to claim 1, wherein the control terminal is provided as a separate part from the case, and the control terminal is inserted into the case for assembly.

8. A method for manufacturing a semiconductor device having a metal base fixed with a semiconductor chip and a control terminal, the method comprising the steps of:

covering a surface of the metal base where the semiconductor chip and the control terminal are fixed with a case, inserting the control terminal through the case, and exposing a blocking section to an outside of the case, the blocking section formed by bending a portion surrounded by a cut-out section cutting out a portion of the control terminal and remaining on the control terminal; and

contacting the blocking section with the case from the outside of the case to lock the control terminal to the case.

9. The method for manufacturing a semiconductor device according to claim 8, wherein the case includes a through hole through which the control terminal passes, and

an opening width of the through hole has a dimension substantially equal to a width of a side surface of the control terminal passing through the through hole, the side surface facing a side section of the through hole.