SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- an insulating substrate joined with a semiconductor chip;
a case covering a surface of the insulating substrate where the semiconductor chip is joined; and
a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case,wherein a portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal, the blocking section contacting the case from the outside of the case and blocking a movement of the control terminal.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device includes an insulating substrate joined with a semiconductor chip, a case covering a surface of the insulating substrate where the semiconductor chip is joined, and a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case. A portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal. The blocking section contacts the case from the outside of the case and blocks a movement of the control terminal.
20 Citations
9 Claims
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1. A semiconductor device comprising:
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an insulating substrate joined with a semiconductor chip; a case covering a surface of the insulating substrate where the semiconductor chip is joined; and a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case, wherein a portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal, the blocking section contacting the case from the outside of the case and blocking a movement of the control terminal. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing a semiconductor device having a metal base fixed with a semiconductor chip and a control terminal, the method comprising the steps of:
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covering a surface of the metal base where the semiconductor chip and the control terminal are fixed with a case, inserting the control terminal through the case, and exposing a blocking section to an outside of the case, the blocking section formed by bending a portion surrounded by a cut-out section cutting out a portion of the control terminal and remaining on the control terminal; and contacting the blocking section with the case from the outside of the case to lock the control terminal to the case. - View Dependent Claims (9)
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Specification