×

TOUCH PANEL AND MANUFACTURING METHOD THEREOF

  • US 20140211109A1
  • Filed: 03/28/2014
  • Published: 07/31/2014
  • Est. Priority Date: 09/29/2007
  • Status: Abandoned Application
First Claim
Patent Images

1. A touch panel, comprising:

  • a substrate;

    a plurality of first sensing serials, disposed on the substrate and extended along a first direction, wherein each of the first sensing serials comprises;

    a plurality of first sensing pads; and

    a plurality of first bridging lines, wherein each of the first bridging lines connects adjacent two first sensing pads in series;

    a plurality of second sensing serials, disposed on the substrate and extended along a second direction, wherein the first direction intersects the second direction, and each of the second sensing serials comprises;

    a plurality of second sensing pads, being substantially coplanar to the first sensing pads with a plurality of gaps between the first sensing pads and the second sensing pads, wherein each of the first sensing pads and the second sensing pads is in rectangular shape; and

    a plurality of second bridging lines, wherein each of the second bridging lines connects adjacent two second sensing pads in series;

    a first dielectric layer, at least disposed between one of the first bridge lines and one of the second bridge lines intersecting to each other; and

    a plurality of dummy patterns, disposed on the substrate, each of the dummy patterns being located between the first sensing pads and the second sensing pads, wherein all of the dummy patterns, the first sensing pads and the second sensing pads are made of a same single layer, all of the dummy patterns, the first sensing pads and the second sensing pads are made of a transmissive conductive material layer, all of the dummy patterns, the first sensing pads and the second sensing pads are substantially coplanar, and all of the dummy patterns, the first sensing pads and the second sensing pads are substantially not overlapped with each other, and wherein each of the gaps between the first sensing pad and the second pad is disposed with at least one dummy pattern, and the dummy pattern is configured along the corresponding sides of the first sensing pad and the second pad.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×