SYSTEM AND METHOD OF DETECTION AND ANALYSIS FOR SEMICONDUCTOR CONDITION PREDICTION

• US 20140214354A1
• Filed: 01/27/2014
• Published: 07/31/2014
• Est. Priority Date: 01/28/2013
• Status: Abandoned Application

• Current Assignee: Henry N. Dreifus
• Original Assignee: Verayo, Inc.
• Inventors: Dreifus, Henry Nardus, Yu, Meng-Day Mandel
• Application Number:
  US14/165,567
• Publication Number:
  US 20140214354A1
• Time in Patent Office: Days
• US Class Current: 702/117
• CPC Class Codes: G01R 31/2856 Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]

Abstract

The invention described here enables in-operation, low-cost, non-invasive measurement of component performance and condition for assessing device longevity prediction, resilience and reliability. The non-invasive component measurements to be performed and subsequently evaluated are based on at least a set of physically unclonable functions and other measurements which can be error corrected, and the error correction factor and other measurements provides insight to the device condition. The system as well is adaptive and allows the introduction of new measurements across not only similar components but to include the family of components similarly fabricated.

Claims

1. A method for monitoring an electronic component based on selecting a set of measurements, the method comprising the steps of:

identifying the set of measurements based on parameters related to the monitoring of the component;

performing the set of measurements to provide measurement data;

evaluating the measurement data to determine if any measurement from the set of measurements can be improved by providing data filtering and data correction; and

processing the measurement data for the set of measurements against a set of corresponding reference measurements to provide analysis of the monitoring.

2. The method of claim 1 further comprising the step of storing the measurement data.

3. The method of claim 1 further comprising the step of communicating the data measurements.

4. The method of claim 3, wherein the communication is through a display.

5. The method of claim 3, wherein the communication is wireless.

6. The method of claim 1, wherein at least one measurement is derived from a physically unclonable function measurement.

7. The method of claim 1, wherein the measurement data is communicated to a computer and the computer evaluates and validates the expected conformance of the measurement data as suitable within acceptable range limits from which a determination can be made that the measurement data is acceptable or not acceptable for processing and evaluation.

8. The method of claim 1, wherein the set of measurements includes a measurement for a weak circuits.

9. The method of claim 1, wherein the step of performing includes improved analytic results to provide corrected values for the measurement data.

10. The method of claim 1, wherein the step of evaluating includes improved analytical results based on applying Kalman filtering techniques.

11. The method of claim 1, wherein the step of evaluating includes improved analytical results based on applying Bayesian filtering techniques.

12. The method of claim 1, wherein the step of evaluating includes improved analytical results based on applying hidden-Markov filtering techniques.

13. The method of claim 1, wherein the step of evaluating includes improved analytical results based on applying fuzzy-logic analysis techniques.

14. The method of claim 1, wherein the step of evaluating includes improved analytical results based on applying neural-network analysis techniques.

15. The method of claim 1 further comprising the step of comparing and adjusting expected baseline data such as predicted calculated changes in performance and resulting measurements are correlated due to component age.

16. The method of claim 1 further comprising the step of comparing and adjusting expected baseline data such as predicted calculated changes in performance and resulting measurements are correlated due to confirmed component condition.

17. The method of claim 1 further comprising the step of applying direct measurement and predicted calculated values for tracking longitudinal changes.

18. The method of claim 1 further comprising the step of algorithmic filtering using multiple sensor inputs to provide corrected values across measurement domains.

19. The method of claim 1 further comprising the step of processing at least one sensor input to compute improved analytic results based on Bayesian analytic techniques across longitudinal changes.

20. The method of claim 1 further comprising the step of processing at least one sensor input to compute improved analytic results based on hidden-Markov Filtering techniques across longitudinal changes.

21. The method of claim 1 further comprising the step of processing at least one sensor input to compute improved analytic results based on fuzzy logic analysis techniques across longitudinal changes.

22. The method of claim 1 further comprising the step of processing at least one sensor input to compute improved analytic results based on neural network analysis techniques across longitudinal changes.

23. The method of claim 1 further comprising the step of calculating expected measurement results based on a time series of a set of at least one performance measurements as adjusted for factors including age, condition, duty cycle, known exposure, and other documented factors.

24. The method of claim 1 further comprising the steps of:

applying direct and calculated values for tracking and calculating the time series expected rates of change versus observed rates of change of any single or multiple sensing dimensions; and

calculating the expected divergence or convergence across multiple sensor time series data of anticipated and expected measured value changes versus unexpected changes.