1-D Tire Patch Apparatus and Methodology

• US 20140215785A1
• Filed: 04/11/2014
• Published: 08/07/2014
• Est. Priority Date: 08/29/2008
• Status: Active Grant

• Current Assignee: Compagnie Generale DES Etablissements Michelin SCA, Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Original Assignee: Compagnie Generale DES Etablissements Michelin SCA, Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Inventors: Weston, David Alan, Hodgkinson, Raymond Leslie
• Granted Patent: US 9,333,811 B2
• Time in Patent Office: Days
• US Class Current: 29/25.35
• CPC Class Codes: B29D 2030/0072 Attaching fasteners to tyres, e.g. patches, in order to connect devices to tyres
• CPC Class Codes: B60C 19/00 Tyre parts or constructions not otherwise provided for
• CPC Class Codes: B60C 2019/004 Tyre sensors other than for detecting tyre pressure
• CPC Class Codes: B60C 23/0411 Piezoelectric generators
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: G01M 17/02 Tyres
• CPC Class Codes: H10N 30/03 Assembling devices that include piezoelectric or electrostrictive parts
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49538 Tire making
• CPC Class Codes: Y10T 29/49826 Assembling or joining
• CPC Class Codes: Y10T 428/24479 including variation in thickness

Abstract

Disclosed is a tire mountable apparatus and method that includes a substrate defining a longitudinal direction, a top surface and a bottom surface. The substrate has a plurality of conductor terminals arranged in a substantially linear relationship. A first support element is located below the bottom surface of the substrate and a second support element is located above the top surface of the substrate. The plurality of conductor terminals are positioned between the first and second support elements. The substrate may be a piezoelectric device having a piezoelectric layer arranged between first and second conductive layers. The plurality of conductor terminals may be arranged in a substantially linear relationship along a line about 80° to about 100° to the longitudinal direction of the substrate, and the longitudinal direction of the substrate being substantially perpendicular to the direction of rotation of the tire.

Claims

1-13. -13. (canceled)

14. A method for reducing strain in a tire mounted assembly, comprising:

providing a substrate defining a longitudinal direction, a top surface and a bottom surface, the substrate comprising a plurality of conductor terminals arranged in a substantially linear relationship;

positioning a first support element beneath the bottom surface of the substrate so that the first support element overlaps the plurality of conductor terminals of the substrate; and

positioning a second support element above the top surface of the substrate so that the second support element overlaps the plurality conductor terminals of the substrate.

15. The method of claim 14, comprising:

positioning the conductor terminals of the substrate along a line about 80°

to about 100°

to the longitudinal direction of the substrate; and

mounting the substrate in a tire so that the longitudinal direction of the substrate is aligned substantially perpendicular to the direction of rotation of the tire.

16. The method of claim 14, wherein the substrate comprises a piezoelectric device comprising a piezoelectric layer positioned between a first conductor layer and a second conductor layer.

17. The method of claim 14, where in the method comprises:

providing a pair of first and second posts extending from the first support element;

connecting each of the first and second posts to one of the plurality of conductor terminals arranged on the substrate; and

securing a printed circuit board to the pair of first and second posts such that the printed circuit board is supported above the second support element.

18. The method of claim 14, wherein the method comprises providing solder at an interface between the first support element, the second support element, and the plurality of conductor terminals.

19. The method of claim 18, wherein the method comprises providing a compression load to the interface between the first support element, the second support element, and the plurality of conductor terminals.

20. The method of claim 19, wherein the method comprises providing the compression load by tightening the connection between the printed circuit board and the first and second posts.