CLEANING COMPOSITION AND METHOD FOR SEMICONDUCTOR DEVICE FABRICATION
First Claim
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1. A method, comprising:
- providing a semiconductor substrate; and
cleaning the semiconductor substrate with a mixture of ozone and at least one of an acid and a base.
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Abstract
A method of cleaning a substrate such as semiconductor substrate for IC fabrication is described that includes cleaning the semiconductor substrate with a mixture of ozone and one of an acid and a base. Exemplary acids and bases include HCl, HF, and NH4OH. The cleaning mixture may further include de-ionized water. In an embodiment, the mixture is sprayed onto a heated substrate surface.
11 Citations
20 Claims
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1. A method, comprising:
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providing a semiconductor substrate; and cleaning the semiconductor substrate with a mixture of ozone and at least one of an acid and a base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of cleaning a semiconductor substrate having a semiconductor device formed thereon, comprising:
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providing a first device operable to hold a fluid; delivering a first mixture of ozone and water to the first device; providing a second device operable to hold a fluid; delivering a second mixture of water and at least one of an acid and a base to the second device; expelling the first mixture from the first device and the second mixture from the second device; mixing the expelled first and second mixtures to form a cleaning solution; and providing the cleaning solution onto a surface of the semiconductor substrate. - View Dependent Claims (14, 15)
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11. The method, further comprising:
providing a stage for the semiconductor substrate, wherein the stage is operable to heat the semiconductor substrate. - View Dependent Claims (12, 13)
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16. A method of fabricating a semiconductor device, comprising:
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forming a first feature on a surface of a semiconductor wafer; spraying a first cleaning mixture onto the first feature on the surface, wherein the first cleaning mixture includes ozone and an acid; and after stopping the spraying of the first cleaning mixture, spraying a second cleaning mixture on the first feature on the surface, wherein the second cleaning mixture includes ozone and NH4OH. - View Dependent Claims (17, 18, 19, 20)
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Specification