LIGHT EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF

• US 20140217437A1
• Filed: 02/07/2013
• Published: 08/07/2014
• Est. Priority Date: 02/07/2013
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Jae Yoon
• Application Number:
  US13/762,144
• Publication Number:
  US 20140217437A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/351 Thermal stress
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

The present application provides for a method for manufacturing a light emitting apparatus. The method includes mounting light emitting elements on a substrate and applying a resin containing phosphors to form wavelength conversion units covering the light emitting elements on the substrate. Portions of the wavelength conversion unit are removed between the light emitting elements. Regions of the substrate are diced, from which the wavelength conversion unit have been removed, to separate the plurality light emitting elements into individual light emitting elements.

Claims

1. A method for manufacturing a light emitting apparatus, the method comprising steps of:

mounting a plurality of light emitting elements on a substrate;

applying a resin containing phosphors to form wavelength conversion units covering the plurality of light emitting elements on the substrate;

removing portions of the wavelength conversion unit between the plurality of light emitting elements; and

dicing regions of the substrate, from which the portions of the wavelength conversion unit have been removed, to separate the plurality of light emitting elements into individual light emitting elements.

2. The method of claim 1, wherein the step of mounting the plurality of light emitting elements comprises:

connecting electrode pads formed on upper surfaces of the plurality of light emitting elements to electrodes formed on the substrate with wires.

3. The method of claim 1, wherein the step of mounting the plurality of light emitting elements comprises:

mounting the plurality of light emitting elements on the substrate such that lower surfaces thereof having the electrode pads formed thereon are in contact with the electrodes of the substrate.

4. The method of claim 1, wherein the step of forming of the wavelength conversion unit includes:

commonly applying a resin containing one or more types of phosphors to the plurality of light emitting elements by way of a printing process.

5. The method of claim 1, wherein the step of removing the portions of the wavelength conversion unit includes:

removing the wavelength conversion unit by way of a laser lift-off process or blade grooving.

6. The method of claim 1, further comprising the step of:

after removing the wavelength conversion unit formed between the plurality of light emitting elements, forming lenses on upper surfaces of the plurality of light emitting elements having the wavelength conversion unit formed thereon.

7. A method for manufacturing a light emitting apparatus, the method comprising steps of:

mounting a plurality of light emitting elements on a substrate;

applying a resin containing phosphors to form wavelength conversion units covering the plurality of light emitting elements on the substrate;

removing portions of the wavelength conversion unit between the plurality of light emitting elements;

filling upper portions of the substrate, from which the wavelength conversion unit have been removed, with a resin to form partition walls; and

dicing the partition walls and the substrate under the partition walls to separate the plurality of light emitting elements into individual light emitting elements.

8. The method of claim 7, wherein the step of mounting the plurality of light emitting elements comprises:

connecting electrode pads formed on upper surfaces of the plurality of light emitting elements to electrodes formed on the substrate with wires.

9. The method of claim 7, wherein the step of mounting the plurality of light emitting elements comprises:

mounting the plurality of light emitting elements on the substrate such that lower surfaces thereof having the electrode pads formed thereon are in contact with the electrodes of the substrate.

10. The method of claim 7, wherein the step of forming of the wavelength conversion unit includes:

commonly applying a resin containing one or more types of phosphors to the plurality of light emitting elements by way of a printing process.

11. The method of claim 7, wherein the step of removing the portions of the wavelength conversion unit includes:

removing the wavelength conversion unit by way of a laser lift-off process or blade grooving

12. The method of claim 7, wherein the resin includes one or more materials among polyphthalamide (PPA), a liquid crystal polymer (LOP), polycarbonate (PC), bismaleimide trizine (BT), and silicon.

13. The method of claim 7, further comprising the step of:

polishing upper surfaces of the wavelength conversion unit and the partition walls, after the forming of the partition walls by filling the upper portions of the substrate, from which the wavelength conversion unit have been removed, with the resin.

14. A method for manufacturing a light emitting apparatus, the method comprising steps of:

forming partition walls confining peripheral regions of light emitting elements on mounting portions in which the light emitting elements are to be mounted on a substrate;

mounting a plurality of light emitting elements on the mounting portions;

applying a resin containing one or more phosphors to inner sides of the partition walls to form wavelength conversion units covering the plurality of light emitting elements;

removing the partition walls; and

dicing the portions of the substrate, from which the partition walls were removed, to separate the plurality of light emitting elements into individual light emitting elements.

15. The method of claim 14, wherein the step of mounting the plurality of light emitting elements comprises:

connecting electrode pads formed on upper surfaces of the plurality of light emitting elements to electrodes formed on the substrate with wires.

16. The method of claim 14, wherein the step of mounting the plurality of light emitting elements comprises:

mounting the plurality of light emitting elements on the substrate such that lower surfaces thereof having the electrode pads formed thereon are in contact with the electrodes of the substrate.

17. The method of claim 14, wherein the step of forming the partition walls comprises:

coating the substrate with a photosensitive polymer and then performing photolithography thereon.

18. The method of claim 14, wherein the step of forming the partition walls includes:

forming the partition walls by way of a dry film laminate (DFL) process.

19. The method of claim 14, further comprising the step of:

after removing the partition walls, forming lenses on upper surfaces of the light emitting elements having the wavelength conversion unit formed thereon.

20. A light emitting apparatus comprising:

a substrate;

light emitting elements mounted on the substrate; and

a wavelength conversion unit formed on upper and lateral surfaces of the plurality of light emitting elements and converting a wavelength of light emitted from the light emitting elements.