SEMICONDUCTOR LIGHT EMITTING DEVICE

• US 20140217448A1
• Filed: 01/29/2014
• Published: 08/07/2014
• Est. Priority Date: 02/05/2013
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Sung-joon, RYU, Young-ho, PARK, Tae-young, JANG, Tae-sung
• Application Number:
  US14/167,885
• Publication Number:
  US 20140217448A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

There is provided a semiconductor light-emitting device having a small size and high light efficiency. The semiconductor light-emitting device includes a substrate; a light-emitting structure that includes a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer are formed on the substrate, wherein the light-emitting structure comprises a first region, a second region, and a light radiation surface on one of the first and second conductive-type semiconductor layers, wherein only the first conductive-type semiconductor layer remains on the substrate in the first region as a part of the second conductive-type semiconductor layer and a part of the active layer are removed, wherein the active layer is disposed between the first and second conductive-type semiconductor layers on the substrate in the second region, a fluorescent body that covers at least a part of the second region on the light radiation surface of the light-emitting structure, and a first electrode and a second electrode which are electrically respectively connected to the first and second conductive-type semiconductor layers so that the first and second electrodes may be connected to a different conductive-type semiconductor layer from each other, wherein the second electrode is formed in the first region on the light radiation surface of the light-emitting structure.

Claims

1. A semiconductor light-emitting device, comprising:

a substrate;

a light-emitting structure that comprises;

a first conductive-type semiconductor layer, an active layer, a second conductive-type semiconductor layer are disposed on the substrate, a first region, a second region, and a light radiation surface on one of the first and second conductive-type semiconductor layers,

wherein only the first conductive-type semiconductor layer remains on the substrate in the first region when a part of the second conductive-type semiconductor layer and a part of the active layer are removed,

wherein the active layer is disposed between the first and second conductive-type semiconductor layers on the substrate in the second region; and

a first electrode and a second electrode which are electrically connected to the first and second conductive-type semiconductor layers respectively so that the first and second electrodes are connected to a different conductive-type semiconductor layer from each other,

wherein the second electrode is disposed in the first region on the light radiation surface of the light-emitting structure.

2. The semiconductor light-emitting device of claim 1, wherein the second electrode is disposed adjacent to an edge of an upper surface of the light-emitting structure.

3. The semiconductor light-emitting device of claim 1, wherein the second electrode is disposed adjacent to a side of the upper surface of the light-emitting structure.

4. The semiconductor light-emitting device of claim 3, further comprising:

a fluorescent body that covers at least a part of the second region on the light radiation surface of the light-emitting structure,

wherein the fluorescent body is separate from the side of the upper surface of the light-emitting structure which the second electrode is adjacent to.

5. The semiconductor light-emitting device of claim 3, further comprising:

an insulating layer covering a side of the active layer which is exposed at a boundary between the first and second regions.

6. The semiconductor light-emitting device of claim 5, wherein the insulating layer extends from the side of the active layer which is exposed at the boundary between the first and second regions to cover the first conductive semiconductor layer in the first region.

7. The semiconductor light-emitting device of claim 6, further comprising:

a non-reflective metal layer on the insulating layer.

8. The semiconductor light-emitting device of claim 1, further comprising:

a fluorescent body covering at least a part of the second region on the light radiation surface of the light-emitting structure, and extending from a boundary between the first and second regions to the first region to cover a part of the first region.

9. The semiconductor light-emitting device of claim 8, wherein an edge of the first region of the fluorescent body is separate from the boundary between the first and second regions and located within 20 μ

m from the boundary between the first and second regions.

10. The semiconductor light-emitting device of claim 8, wherein the fluorescent body further covers a part of the second electrode.

11. The semiconductor light-emitting device of claim 1, wherein:

the second electrode contacts the first conductive-type semiconductor layer in the first region, and

the first electrode is electrically connected to the second conductive-type semiconductor layer, and the substrate is a conductive substrate that functions as the first electrode.

12. The semiconductor light-emitting device of claim 1, further comprising:

a reflective metal layer between the second conductive-type semiconductor layer and the first electrode.

13. The semiconductor light-emitting device of claim 1, wherein the light-emitting structure further comprises:

a third region separate from the first region and, when a part of the second conductive-type semiconductor layer and a part of the active layer are removed, to expose the first conductive-type semiconductor layer, and

a current dispersion layer that is disposed in both the first and second regions of the light-emitting structure, and

wherein the first electrode is disposed in the third region to contact the first conductive-type semiconductor layer, and

wherein the second electrode is connected to the second conductive-type semiconductor layer via the current dispersion layer.

14. A semiconductor light-emitting device, comprising:

a conductive substrate;

a light-emitting structure that comprises;

a first conductive-type semiconductor layer, an active layer, a second conductive-type semiconductor layer are disposed on the substrate, a first region and a second region,

wherein only the first conductive-type semiconductor layer remains on the substrate in the first region when a part of the second conductive-type semiconductor layer and a part of the active layer are removed, and

wherein the active layer is disposed between the first and second conductive-type semiconductor layers on the substrate in the second region;

an insulating layer covering a side of the active layer which is exposed at a boundary between the first and second regions;

a pad electrode disposed in the first region and is electrically connected to the second conductive-type semiconductor layer; and

a fluorescent body covering the second region,

wherein the conductive substrate is electrically connected to the first conductive-type semiconductor layer.

15. The semiconductor light-emitting device of claim 14, wherein:

the pad electrode adjacent to an edge of an upper surface of the second conductive-type semiconductor layer, and

the fluorescent body extending from the boundary between the first and second regions to the first region, covering a part of an upper surface of the second conductive-type semiconductor layer in the first region, and is separate from an edge of the upper surface of the second conductive-type semiconductor layer which the second electrode is adjacent to.

16. A semiconductor light-emitting package comprising a semiconductor light-emitting device, the semiconductor light-emitting device including:

a conductive substrate;

a light-emitting structure that comprises;

a first conductive-type semiconductor layer, an active layer, a second conductive-type semiconductor layer are disposed on the substrate, a first region and a second region,

wherein only the first conductive-type semiconductor layer remains on the substrate in the first region when a part of the second conductive-type semiconductor layer and a part of the active layer are removed, and

wherein the active layer is disposed between the first and second conductive-type semiconductor layers on the substrate in the second region;

an insulating layer covering a side of the active layer which is exposed at a boundary between the first and second regions;

a pad electrode disposed in the first region and is electrically connected to the second conductive-type semiconductor layer; and

a fluorescent body covering the second region,

wherein the conductive substrate is electrically connected to the first conductive-type semiconductor layer.

17. The semiconductor light-emitting package of claim 16, wherein the fluorescent body is formed of a material selected from a yttrium aluminum garnet (YAG)-based material, a terbium aluminum garnet (TAG)-based material, a sulfide-based material, a nitride-based material, or a quantum-point fluorescent material.

18. The semiconductor light-emitting package of claim 16, further comprising:

a reflective metal disposed on the second region on the second conductive-type semiconductor layer.

19. The semiconductor light-emitting package of claim 16, wherein the light-emitting structure further comprises a light radiation surface disposed in a part of the first and second regions.

20. The semiconductor light-emitting package of claim 19, wherein the fluorescent body covers at least a part of the second region on the light radiation surface of the light-emitting structure.