DOUBLE-SIDED PACKAGE

• US 20140217566A1
• Filed: 02/01/2013
• Published: 08/07/2014
• Est. Priority Date: 02/01/2013
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Goida, Thomas M., Xue, Xiaojie
• Granted Patent: US 9,209,121 B2
• Time in Patent Office: Days
• US Class Current: 257/676
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

Various embodiments of an integrated device package are disclosed herein. The package may include a leadframe having a first side and a second side opposite the first side. The leadframe can include a plurality of leads surrounding a die mounting region. A first package lid may be mounted on the first side of the leadframe to form a first cavity, and a first integrated device die may be mounted on the first side of the leadframe within the first cavity. A second integrated device die can be mounted on the second side of the leadframe. At least one lead of the plurality of leads can provide electrical communication between the first integrated device die and the second integrated device die.

Claims

1. An integrated device package comprising:

a leadframe having a first side and a second side opposite the first side, the leadframe including a plurality of leads surrounding a die mounting region;

a first package lid mounted on the first side of the leadframe to form a first cavity;

a first integrated device die mounted on the first side of the leadframe within the first cavity; and

a second integrated device die mounted on the second side of the leadframe, wherein at least one lead of the plurality of leads provides electrical communication between the first integrated device die and the second integrated device die.

2. The integrated device package of claim 1, wherein the first integrated device die is a processor die and the second integrated device die is a sensor die.

3. The integrated device package of claim 1, further comprising a third integrated device die mounted on the first side of the leadframe adjacent the first integrated device die.

4. The integrated device package of claim 1, further comprising a third integrated device die stacked on top of the first integrated device die such that the first integrated device die is disposed between the third integrated device die and the leadframe.

5. The integrated device package of claim 4, wherein the first integrated device die is a processor die, and the second and third integrated device dies are inertial motion sensor dies.

6. The integrated device package of claim 5, wherein the second integrated device die is an accelerometer die, and the third integrated device die is a gyroscope die.

7. The integrated device package of claim 6, further comprising a second package lid mounted on the second side of the leadframe to form a second cavity, the accelerometer die positioned within the second cavity.

8. The integrated device package of claim 6, further comprising an encapsulant applied over the second side of the leadframe to encapsulate the accelerometer die.

9. The integrated device package of claim 6, wherein the gyroscope die and the accelerometer die are microelectromechanical systems (MEMS) dies.

10. The integrated device package of claim 4, wherein the plurality of leads includes a first set of leads and a second set of leads, wherein the second integrated device die is wire bonded to the second side of one or more inner lead portions of the first set of leads, and wherein the first integrated device die is wire bonded to the first side of the one or more inner lead portions of the first set of leads to provide electrical communication between the first integrated device die and the second integrated device die.

11. The integrated device package of claim 10, wherein the first integrated device die is wire bonded to one or more inner lead portions of the second set of leads, the second set of leads further including outer lead portions protruding outwardly from a body of the integrated device package, the outer lead portions configured to electrically couple to a mounting board to provide electrical communication between the integrated device package and the mounting board.

12. The integrated device package of claim 4, wherein the third integrated device die is wire bonded to the first integrated device die.

13. The integrated device package of claim 1, wherein the leadframe is molded in a molding material, the molding material including a via formed therethrough and filled with a conductive material to provide electrical communication between the first package lid and one lead of the plurality of leads.

14. A method of packaging an integrated device, the method comprising:

providing a leadframe having a first side and a second side opposite the first side, the leadframe including a die attach pad, a first set of leads adjacent the die attach pad and having an inner lead portion, and a second set of leads adjacent the die attach pad and having an inner lead portion and an outer lead portion, the outer lead portion configured to electrically couple to a mounting board;

mounting a first integrated device die on the first side of the die attach pad;

wire bonding the first integrated device die to the first side of the inner lead portions of at least some leads in the first set of leads;

wire bonding the first integrated device die to the first side of the inner lead portions of at least some leads in the second set of leads;

mounting a second integrated device die on the second side of the die attach pad; and

wire bonding the second integrated device die to the second side of the inner lead portions of at least some leads in the first set of leads to provide electrical communication between the first integrated device die and the second integrated device die.

15. The method of claim 14, wherein mounting the first integrated device die comprises mounting a processor die, wherein mounting the second integrated device die comprises mounting a first inertial motion sensor die, the method further comprising:

stacking a second inertial motion sensor die on the processor die; and

wire bonding the second inertial motion sensor die to the processor die.

16. The method of claim 15, further comprising mounting a first package lid on the first side of the leadframe to form a first cavity and to enclose the processor die and the second inertial motion sensor die within the first cavity.

17. The method of claim 16, further comprising mounting a second package lid on the second side of the leadframe to form a second cavity and enclose the first inertial motion sensor die within the second cavity.

18. The method of claim 16, further comprising applying an encapsulant over the second side of the leadframe to encapsulate the first inertial motion sensor die.

19. The method of claim 14, wherein each lead of the first set of leads further include an outer lead portion, the method further comprising removing the outer lead portions of the leads in the first set of leads.

20. The method of claim 14, wherein providing the leadframe comprises providing a molded leadframe.

21. An integrated device package comprising:

a package substrate having a first side and a second side opposite the first side;

a first motion sensor die mounted on the first side of the package substrate; and

a second motion sensor die mounted on the second side of the package substrate.

22. The integrated device package of claim 21, wherein the first motion sensor die is a gyroscope die or an accelerometer die, and wherein the second motion sensor die is a gyroscope die or an accelerometer die.

23. The integrated device package of claim 21, wherein the package substrate comprises a leadframe, the leadframe comprising a die attach pad and a plurality of leads surrounding the die attach pad.

24. The integrated device package of claim 23, wherein the leadframe comprises a molded leadframe.

25. The integrated device package of claim 23, further comprising a processor die mounted on the first side of the package substrate, wherein the first motion sensor die is stacked on top of the processor die such that the processor die is disposed between the first motion sensor die and the package substrate.

26. The integrated device package of claim 21, further comprising a first package lid mounted on the first side of the package substrate to form a first cavity, the first motion sensor die mounted within the first cavity.

27. The integrated device package of claim 26, further comprising a second package lid mounted on the second side of the package substrate to form a second cavity, the second motion sensor die mounted within the second cavity.

28. The integrated device package of claim 26, further comprising an encapsulant applied over the second side of the package substrate to encapsulate the second motion sensor die.