SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor device, comprising:
- a metal pad, positioned on a first metal layer of the semiconductor device; and
a first specific metal layer routing, formed on a second metal layer of the semiconductor device, and directly under the metal pad.
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Abstract
The present invention provides a semiconductor device. The semiconductor device comprises: a metal pad and a first specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device. The first specific metal layer routing is formed on a second metal layer of the semiconductor device, and directly under the metal pad.
18 Citations
17 Claims
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1. A semiconductor device, comprising:
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a metal pad, positioned on a first metal layer of the semiconductor device; and a first specific metal layer routing, formed on a second metal layer of the semiconductor device, and directly under the metal pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification