LOW PROFILE PACKAGING AND ASSEMBLY OF A POWER CONVERSION SYSTEM IN MODULAR FORM

• US 20140218155A1
• Filed: 01/24/2014
• Published: 08/07/2014
• Est. Priority Date: 02/01/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Arnold, Shawn X., Akre, Sunil M.
• Granted Patent: US 9,936,579 B2
• Time in Patent Office: Days
• US Class Current: 336/192
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module includes an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, and input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component are thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.

Claims

1. A low profile power conversion system module comprising:

an embedded power substrate, the embedded power substrate being thin planar-shaped;

an embedded power silicon disposed within the embedded power substrate;

a magnetic component disposed on top of the embedded power substrate, the magnetic component being thin planar-shaped; and

input/output terminals disposed on a side of the embedded power substrate, the input/output terminals configured to supply power and signal to the embedded power silicon and the magnetic component.

2. The module of claim 1, wherein the embedded power substrate is comprised of PCB (printed circuit board).

3. The module of claim 1 further comprising of an embedded passive component disposed within the embedded power substrate.

4. The module of claim 1, wherein the magnetic component is comprised of a magnetic core with embedded winding.

5. The module of claim 1, wherein the input/output terminals are co-planar with the embedded power substrate.

6. The module of claim 1, wherein the input/output terminals are protruding above the embedded power substrate.

7. The module of claim 1, wherein the power conversion system module is disposed on a top surface of a system PCB (printed circuit board).

8. The module of claim 1, wherein the power conversion system module is disposed on a bottom surface of a system PCB (printed circuit board).

9. The module of claim 1, wherein the power conversion system module is disposed to be partially within an opening formed in a system PCB (printed circuit board).

10. A method for using a low profile power conversion system module, the method comprising:

providing the low profile power conversion system module, wherein the low profile power conversion system module comprises;

an embedded power substrate, the embedded power substrate being thin planar-shaped,

an embedded power silicon disposed within the embedded power substrate,

a magnetic component disposed on top of the embedded power substrate, the magnetic component being thin planar-shaped, and

input/output terminals disposed on a side of the embedded power substrate, the input/output terminals configured to supply power and signal to the embedded power silicon and the magnetic component; and

configuring the low profile power conversion system module on a system PCB (printed circuit board).

11. The method of claim 10, wherein the module further comprises:

an embedded passive component disposed within the embedded power substrate.

12. The method of claim 10, wherein the magnetic component is comprised of a magnetic core with embedded winding.

13. The method of claim 10, wherein the input/output terminals are co-planar with the embedded power substrate.

14. The method of claim 10, wherein the input/output terminals are protruding above the embedded power substrate.

15. The method of claim 10, wherein configuring the low profile power conversion system module on a system PCB comprises:

disposing the power conversion system module on a top surface of the system PCB.

16. The method of claim 10, wherein configuring the low profile power conversion system module on a system PCB comprises:

disposing the power conversion system module on a bottom surface of the system PCB.

17. The method of claim 10, wherein configuring the low profile power conversion system module on a system PCB comprises:

disposing the power conversion system module partially within an opening formed in the system PCB.

18. A power conversion device comprising:

an embedded power substrate, the embedded power substrate being thin planar-shaped;

a power silicon disposed within the embedded power substrate;

a magnetic component disposed within the embedded power substrate; and

input/output terminals disposed on the side of the embedded power substrate, the input/output terminals configured to supply power and signal to the power silicon and the magnetic component.

19. The device of claim 18, wherein the embedded power substrate is comprised of PCB (printed circuit board).

20. The device of claim 18, wherein the magnetic component is comprised of a magnetic core with embedded winding.