SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SIGNAL TRANSMITTING/RECEIVING METHOD USING THE SEMICONDUCTOR DEVICE

• US 20140225221A1
• Filed: 04/17/2014
• Published: 08/14/2014
• Est. Priority Date: 12/04/2007
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: Nakashiba, Yasutaka
• Granted Patent: US 9,685,496 B2
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: H01L 28/10 Inductors

Abstract

A semiconductor device includes a semiconductor chip including a main surface, an internal circuit including a plurality of transistors, formed on the main surface, a bonding pad electrically connected to the internal circuit, formed on the main surface, an inductor for communicating an external device in a non-contact manner, formed on the main surface, and a seal ring formed along an outer peripheral edge of the semiconductor chip to surround the internal circuit and the bonding pad in a plan view. The inductor has a configuration to surround the internal circuit and the bonding pad in the plan view and along the seal ring. The inductor is arranged inside the seal ring.

Claims

1. A semiconductor device, comprising:

a semiconductor chip comprising a main surface;

an internal circuit including a plurality of transistors, formed on said main surface;

a bonding pad electrically connected to said internal circuit, formed on said main surface;

an inductor for communicating an external device in a non-contact manner, formed on said main surface; and

a seal ring formed along an outer peripheral edge of said semiconductor chip to surround said internal circuit and said bonding pad in a plan view,

wherein said inductor has a configuration to surround said internal circuit and said bonding pad in the plan view and along said seal ring, and

wherein said inductor is arranged inside said seal ring.

2. The semiconductor device according to claim 1, wherein said inductor is electrically connected to an input of circuit of said internal circuit, and

wherein said bonding pad is electrically connected to an output circuit of said internal circuit.