HEAT DISSIPATION STRUCTURE, POWER MODULE, METHOD OF MANUFACTURING HEAT DISSIPATION STRUCTURE, AND METHOD OF MANUFACTURING POWER MODULE

• US 20140226284A1
• Filed: 09/20/2012
• Published: 08/14/2014
• Est. Priority Date: 09/28/2011
• Status: Abandoned Application

• Current Assignee: NHK Spring Company Limited
• Original Assignee: NHK Spring Company Limited
• Inventors: Yamauchi, Yuichiro, Saito, Shinji, Akabayashi, Masaru, Mori, Shogo
• Application Number:
  US14/345,769
• Publication Number:
  US 20140226284A1
• Time in Patent Office: Days
• US Class Current: 361/722
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: C23C 24/04 Impact or kinetic deposition of particles
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A heat dissipation structure includes a ceramic substrate having an insulation quality, a metal member containing a metal or an alloy and joined to a surface of the ceramic substrate by a brazing material, a metal film layer formed by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on a surface of the metal member, and a heat pipe that is in a rod shape and capable of controlling a temperature and comprises a heat absorbing unit configured to absorb heat from outside at one end of the heat pipe and a heat dissipating unit configured to dissipate heat to the outside at another end of the heat pipe, wherein the heat absorbing unit is embedded inside the metal film layer.

Claims

1. A heat dissipation structure comprising:

a ceramic substrate having an insulation quality;

a metal member containing a metal or an alloy and joined to a surface of the ceramic substrate by a brazing material;

a metal film layer formed by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on a surface of the metal member; and

a heat pipe that is in a rod shape and capable of controlling a temperature and comprises a heat absorbing unit configured to absorb heat from outside at one end of the heat pipe and a heat dissipating unit configured to dissipate heat to the outside at another end of the heat pipe,

wherein the heat absorbing unit is embedded inside the metal film layer.

2. The heat dissipation structure according to claim 1, wherein the ceramic substrate contains nitride-based ceramic.

3. The heat dissipation structure according to claim 1, wherein the brazing material is an aluminum-based brazing material.

4. The heat dissipation structure according to claim 3, wherein the brazing material contains at least one type of metal selected from the group consisting of germanium, magnesium, silicon and copper.

5. The heat dissipation structure according to claim 1, wherein the metal member contains a metal selected from the group consisting of aluminum, silver, nickel, gold and copper, or an alloy containing the metal.

6. The heat dissipation structure according to claim 1, wherein the metal film layer contains a metal selected from the group consisting of copper, aluminum and silver, or an alloy containing the metal.

7. A power module comprising:

a ceramic substrate having an insulation quality;

a first metal member containing a metal or an alloy and joined to a surface of the ceramic substrate by a brazing material;

a metal film layer formed by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on a surface of the first metal member;

a heat pipe that is in a rod shape and capable of controlling a temperature and comprises a heat absorbing unit configured to absorb heat from outside at one end of the heat pipe and a heat dissipating unit configured to dissipate heat to the outside at another end of the heat pipe;

a second metal member containing a metal or an alloy and joined by the brazing material to a surface, opposing the surface on which the metal film layer is formed, of the ceramic substrate;

a circuit layer formed on the second metal member; and

a power device mounted on the circuit layer,

wherein the heat absorbing unit is embedded inside the metal film layer.

8. The power module according to claim 7 wherein the circuit layer is formed by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state through a mask on a surface of the second metal member.

9. A method of manufacturing a heat dissipation structure, the method comprising:

metal member joining step for joining a metal member containing a metal or an alloy to a surface of a ceramic substrate having an insulation quality by a brazing material; and

film forming step for arranging, on the metal member, a heat pipe that is in a rod shape and capable of controlling a temperature and comprises a heat absorbing unit configured to absorb heat from outside at one end of the heat pipe and a heat dissipating unit configured to dissipate heat to the outside at another end of the heat pipe and forming a metal film layer by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on the metal member on which the heat absorbing unit of the heat pipe is arranged.

10. The method of manufacturing the heat dissipation structure according to claim 9, wherein the metal member joining step includes:

brazing material arranging step for arranging the brazing material on the surface of the ceramic substrate;

metal member arranging step for arranging the metal member on the brazing material; and

heat treating step for heat-treating the ceramic substrate on which the brazing material and the metal member are arranged in order.

11. The method of manufacturing the heat dissipation structure according to claim 10, wherein the brazing material arranging step includes any one of applying a brazing material paste to the ceramic substrate, placing brazing material foil on the ceramic substrate, and adhering the brazing material to the ceramic substrate by the vapor deposition method or the sputtering method.

12. The method of manufacturing the heat dissipation structure according to claim 10, wherein the heat treating step is performed in a vacuum or an inert gas atmosphere.

13. The method of manufacturing the heat dissipation structure according to claim 12, wherein the brazing material is an aluminum-based brazing material containing at least one type of metal selected from the group consisting of germanium, magnesium, silicon and copper.

14. The method of manufacturing the heat dissipation structure according to claim 9, wherein the metal member is 1 mm or below in thickness.

15. The method of manufacturing the heat dissipation structure according to claim 9, wherein the film forming step includes:

first film forming step for forming the metal film layer on a surface of the metal member by accelerating a powder containing a metal or an alloy with a gas, and by spraying and depositing the powder in a solid phase state on the surface of the metal member;

groove portion forming step for forming a groove portion, in which the heat pipe is to be arranged, by cutting the metal film layer formed at the first film forming step; and

second film forming step for forming the metal film layer, after the heat pipe has been arranged in the groove portion, by accelerating the powder containing a metal or an alloy with the gas, and by spraying and depositing the powder in a solid phase state on the surface of the metal member.

16. A method of manufacturing a power module, the method comprising:

first metal member joining step for joining a first metal member containing a metal or an alloy to a surface of a ceramic substrate having an insulation quality by a brazing material; and

film forming step for arranging, on the first metal member, a heat pipe that is in a rod shape and capable of controlling a temperature and comprises a heat absorbing unit configured to absorb heat from outside at one end of the heat pipe and a heat dissipating unit configured to dissipate heat to the outside at another end of the heat pipe and forming a metal film layer by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on the first metal member on which the heat absorbing unit of the heat pipe is arranged;

a second metal member joining step for joining a second metal member containing a metal or an alloy by a brazing material to a surface, opposing the surface on which the metal film layer is formed, of the ceramic substrate;

circuit layer forming step for forming, on the second metal member, a circuit layer by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on the surface of the second metal member; and

power device mounting step for mounting a power device on the circuit layer,

wherein the first metal member joining step and the second metal member joining step are simultaneously performed.