Component and Method for Producing a Component
2 Assignments
0 Petitions
Accused Products
Abstract
A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.
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Citations
35 Claims
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1-15. -15. (canceled)
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16. A component comprising:
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a substrate; a chip; a frame, the frame, the substrate and the chip enclosing a volume; and a metal sealing layer which hermetically seals the volume, the metal sealing layer comprising a solidified liquid metal or a solidified liquid metal alloy. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for producing a component having a substrate, a chip and a frame, the method comprising:
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enclosing a volume between the frame, the substrate and the chip; and hermetically sealing the volume with a metal sealing layer by applying a liquid metal or a liquid metal alloy onto the component and solidifying the liquid metal or the liquid metal alloy. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
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Specification