WAFER TRANSFER BLADE AND WAFER TRANSFER APPARATUS HAVING THE SAME

• US 20140227072A1
• Filed: 02/12/2014
• Published: 08/14/2014
• Est. Priority Date: 02/14/2013
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: LEE, Dong-Yoon, MUN, Jun-Young, PARK, Dong-Il, JUNG, Suk-Yong, HWANG, Bo-Young
• Application Number:
  US14/178,392
• Publication Number:
  US 20140227072A1
• Time in Patent Office: Days
• US Class Current: 414/744.3
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

A wafer transfer blade including a body including metal oxide and configured to support a wafer, and an adsorbing part on the body, the adsorbing part having at least one therein and configured to apply vacuum pressure to attach the wafer on the body may be provided. The body may include metal oxide to prevent static electricity.

Claims

1. A wafer transfer blade comprising:

a body configured to support a wafer, the body including metal oxide and at least one first vacuum hole defined therein, and the first vacuum hole configured to apply vacuum pressure therethrough such that the wafer is attached to the body.

2. The wafer transfer blade of claim 1, wherein the metal oxide includes titanium dioxide.

3. The wafer transfer blade of claim 2, further comprising;

a first branch extending from the body; and

a second branch extending form the body,

wherein the first branch includes at least one second vacuum hole defined therein, the second branch includes at least one third vacuum hole defined therein, and the first to third vacuum holes configured to apply vacuum pressures therethrough such that the wafer is attached to the body.

4. The wafer transfer blade of claim 3, wherein the body, the first branch, and the second branch form a Y-shape, and the first to third vacuum holes are disposed in a triangle.

5. The wafer transfer blade of claim 4, wherein the body, the first branch, and the second branch are configured to contact the wafer when the wafer is carried thereon.

6. The wafer transfer blade of claim 5, further comprising:

a first contact pad on the body, the first contact pad having a first opening;

a second contact pad on the first branch, the second contact pad having a second opening; and

a third contact pad on the second branch, the third contact pad having a third opening, wherein

the first to third vacuum holes are connected to the first to third openings of the first to third contact pads, respectively, and

the first to third contact pads are configured to contact the wafer such that the body, the first branch, and the second branch are spaced apart from the wafer when the wafer is carried on the wafer transfer blade.

7. The wafer transfer blade of claim 6, wherein the first to third contact pads include polyimide plastic.

8. The wafer transfer blade of claim 6, further comprising:

a ground part connected to the body.

13. A wafer transfer apparatus comprising:

the wafer transfer blade of claim 1; and

a first arm connected to the wafer transfer blade.

14. The wafer transfer apparatus of claim 13, wherein the metal oxide includes titanium dioxide.

15. The wafer transfer apparatus of claim 13, further comprising:

a second arm connected to the first arm,

wherein the wafer transfer blade configured to move up and down and right and left based on movements of the first arm and the second arm.

9. A wafer transfer blade comprising:

a body configured to support a wafer, the body including metal oxide;

a first guide wall at a first end of the body; and

a second guide wall at a second end of the body, the second end being opposite to the first end.

10. The wafer transfer blade of claim 9, wherein the metal oxide includes titanium dioxide.

11. The wafer transfer blade of claim 10, wherein the body is configured to contact the wafer when the wafer is carried thereon.

12. The wafer transfer blade of claim 10, further comprising:

a plurality of contact pads on the body,

wherein when the wafer is carried on the wafer transfer blade in contact with the contact pads, the wafer is spaced apart from the body.

16. A wafer transfer blade comprising:

a body configured to support a wafer, the body including metal oxide and including a wafer holding portion configured to hold the wafer.

17. The wafer transfer blade of claim 16, wherein the wafer holding portion includes at least one vacuum hole defined in the body, the vacuum hole configured to apply vacuum pressure therethrough.

18. The wafer transfer blade of claim 16, wherein the wafer holding portion includes at least one elastic contact pad.

19. The wafer transfer blade of claim 18, wherein the elastic contact pad includes an opening defined therein, the wafer holding portion includes at least one vacuum hole, and the vacuum hole is connected to the opening and is configured to provide vacuum pressure through the opening.

20. The wafer transfer blade of claim 16, wherein the wafer holding portion is defined by at least one guide wall at at least one end of the body, the guide wall configured to confine the wafer within the wafer holding portion.