DISCRETE PHOSPHOR CHIPS FOR LIGHT-EMITTING DEVICES AND RELATED METHODS
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0 Petitions
Accused Products
Abstract
In accordance with certain embodiments, phosphor chips are formed and subsequently attached to light-emitting elements.
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Citations
170 Claims
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1-128. -128. (canceled)
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129. A method for manufacture of an electronic device comprising:
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providing an optic having a plurality of optical elements on a first side and a plurality of depressions defined by a second side opposite the first side, wherein at least one optical element is aligned with at least one depression; providing at least one discrete phosphor chip, each phosphor chip comprising (i) a light-conversion material and (ii) a binder comprising at least one of silicone or epoxy; inserting each phosphor chip within a different depression in the optic; providing a substrate having a plurality of conductive traces on a surface thereof, each pair of conductive traces being separated on the substrate by a gap therebetween; providing a plurality of light-emitting elements (LEEs) each having first and second spaced-apart contacts, the optic being substantially transparent to at least one of a wavelength of light emitted by the LEEs or the at least one phosphor chip; for each LEE, across each gap disposed between a pair of conductive traces on the substrate, electrically coupling the first contact of the LEE to one of the pair of conductive traces and electrically coupling the second contact of the LEE to the other one of the pair of conductive traces; and thereafter, mating the substrate to the optic, whereby at least one phosphor chip is positioned to receive light from at least one LEE and each optical element is positioned to receive light from at least one LEE. - View Dependent Claims (130, 131, 132, 133, 135, 136, 138, 139, 140, 142, 143, 144, 145, 147, 148, 150, 151, 153, 169)
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134. (canceled)
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137. (canceled)
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141. (canceled)
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146. (canceled)
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149. (canceled)
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152. (canceled)
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154-168. -168. (canceled)
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170-173. -173. (canceled)
Specification