BUILDING SUPPORT WITH CONCEALED ELECTRONIC COMPONENT FOR A STRUCTURE

• US 20140230342A1
• Filed: 04/02/2014
• Published: 08/21/2014
• Est. Priority Date: 02/21/2013
• Status: Active Application

• Current Assignee: CFM Global LLC
• Original Assignee: CFM Global LLC
• Inventors: Macioch, Christopher P., Pingitore, Michael J., Pingitore, Frank C.
• Application Number:
  US14/242,905
• Publication Number:
  US 20140230342A1
• Time in Patent Office: Days
• US Class Current: 52/27
• CPC Class Codes: G06F 11/3006 where the computing system is distributed, e.g. networked systems, clusters, multiprocessor systems multiprogramming arrangements G06F9/46; allocation of resources G06F9/50
• CPC Class Codes: G06F 11/3034 where the computing system component is a storage system, e.g. DASD based or network based digital input from or digital output to record carriers G06F3/06; digital recording or reproducing G11B20/18; for distributed storage of data in networks, e.g. transport arrangements for network file system [NFS], storage area networks [SAN] or network attached storage [NAS], H04L67/1097
• CPC Class Codes: G06F 11/3055 Monitoring arrangements for monitoring the status of the computing system or of the computing system component, e.g. monitoring if the computing system is on, off, available, not available error or fault processing without redundancy G06F11/0703; error detection or correction by redundancy in data representation G06F11/08; error detection or correction by redundancy in operation G06F11/14; error detection or correction by redundancy in hardware G06F11/16
• CPC Class Codes: G06F 11/3452 Performance evaluation by statistical analysis
• CPC Class Codes: H04L 12/14 Charging , metering or billing arrangements for data wireline or wireless communications
• CPC Class Codes: H04L 43/0876 Network utilisation, e.g. volume of load or congestion level
• CPC Class Codes: H04L 43/10 Active monitoring, e.g. heartbeat, ping or trace-route
• CPC Class Codes: H04L 67/1097 for distributed storage of data in networks, e.g. transport arrangements for network file system [NFS], storage area networks [SAN] or network attached storage [NAS]
• CPC Class Codes: H04M 15/00 Arrangements for metering, time-control or time indication ; Metering, charging or billing arrangements for voice wireline or wireless communications, e.g. VoIP
• CPC Class Codes: H04W 4/24 Accounting or billing
• CPC Class Codes: H05K 7/1497 Rooms for data centers; Shipping containers therefor

Abstract

Building support with a concealed electronic component for a structure, including: a rigid support member; a mounting attachment affixed to the rigid support member, the mounting attachment adapted to support an electronic component; and a transceiver coupled to the electronic component, the transceiver adapted to support an external communication link. Other embodiments provide a backing material to support an electronic component concealed within a building structural element, wherein the building structural element comprises one or more rigid building support members, the backing material including: a substrate; a structure attachment along at least one surface of the substrate, the attachment adapted to attach the substrate to a rigid building support member; and one or more electronic component attachments disposed on a major surface of the rigid substrate.

Claims

1. A building support with a concealed electronic component for a structure, comprising:

a rigid support member;

a mounting attachment affixed to the rigid support member, the mounting attachment adapted to support the concealed electronic component; and

a transceiver coupled to the concealed electronic component, the transceiver adapted to support an external communication link.

2. The building support of claim 1, wherein the building support comprises a wall stud.

3. The building support of claim 1, wherein the building support comprises a floor joist.

4. The building support of claim 1, wherein the building support comprises a heating and cooling duct.

5. The building support of claim 1, wherein the building support comprises a concrete slab, the concrete slab comprising a void adapted to enclose the concealed electronic component.

6. The building support of claim 1, wherein the building support is positioned in an area above a false ceiling.

7. The building support of claim 1, wherein the building support is positioned in an area below a raised floorboard.

8. The building support of claim 1, wherein the building support comprises an item selected from a group consisting of a hollow core door, a rooftop, an outdoor structure, an element of a garage, an element of a shed.

9. A backing material to support an electronic component concealed within a building structural element, wherein the building structural element comprises one or more rigid building support members, the backing material comprising:

a substrate;

a structure attachment along at least one surface of the substrate, the attachment adapted to attach the substrate to a rigid building support member; and

one or more electronic component attachments disposed on a major surface of the rigid substrate.

10. The backing material of claim 9, wherein the substrate comprises a flexible substrate, wherein the substrate when draped between adjacent rigid building support members, is adapted to substantially maintain a predetermined relative physical configuration among a plurality of electronic components coupled to the one or more electronic component attachments.

11. The backing material of claim 9, wherein the substrate comprises a substantially rigid substrate.

12. The backing material of claim 9, wherein the rigid building support member comprises a wall stud.

13. The backing material of claim 9, wherein the substrate is adapted to be supported by one rigid building support member.

14. The backing material of claim 9, wherein the substrate may be coupled to a second substantially rigid substrate.

15. The backing material of claim 9, wherein the electronic component comprises a data storage device.

16. The backing material of claim 10, wherein the plurality of electronic components comprise a data farm.

17. The backing material of claim 16, wherein the plurality of electronic components further comprise a transceiver adapted to support an external communication link.