SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

• US 20140231802A1
• Filed: 04/29/2014
• Published: 08/21/2014
• Est. Priority Date: 09/04/2009
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: SAKAKURA, Masayuki, OIKAWA, Yoshiaki, YAMAZAKI, Shunpei, SAKATA, Junichiro, TSUBUKU, Masashi, AKIMOTO, Kengo, HOSOBA, Miyuki
• Granted Patent: US 9,601,516 B2
• Time in Patent Office: Days
• US Class Current: 257/43
• CPC Class Codes: G02F 1/134309 characterised by their geometrical arrangement
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: G02F 2202/10 semiconductor
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors

Abstract

The semiconductor device includes a driver circuit portion including a driver circuit and a pixel portion including a pixel. The pixel includes a gate electrode layer having a light-transmitting property, a gate insulating layer, a source electrode layer and a drain electrode layer each having a light-transmitting property provided over the gate insulating layer, an oxide semiconductor layer covering top surfaces and side surfaces of the source electrode layer and the drain electrode layer and provided over the gate electrode layer with the gate insulating layer therebetween, a conductive layer provided over part of the oxide semiconductor layer and having a lower resistance than the source electrode layer and the drain electrode layer, and an oxide insulating layer in contact with part of the oxide semiconductor layer.

Claims

1. (canceled)

2. A semiconductor device comprising:

a first transistor comprising;

a first gate electrode layer over an insulating surface;

a gate insulating layer over the first gate electrode layer;

a first oxide semiconductor layer over the first gate electrode layer; and

a first source electrode layer and a first drain electrode layer over the first oxide semiconductor layer;

a second transistor comprising;

a second gate electrode layer over the insulating surface;

the gate insulating layer over the second gate electrode layer;

a second source electrode layer and a second drain electrode layer over the gate insulating layer; and

a second oxide semiconductor layer over the second gate electrode layer, the second source electrode layer and the second drain electrode layer; and

a capacitor comprising;

a first electrode over the insulating surface;

the gate insulating layer over the first electrode;

a second electrode over the gate insulating layer; and

an oxide semiconductor layer over the second electrode,

wherein each of the second gate electrode layer, the gate insulating layer, the second source electrode layer, the second drain electrode layer, and the second oxide semiconductor layer has a light-transmitting property.

3. The semiconductor device according to claim 2, further comprising:

a first channel formation region in the first oxide semiconductor layer; and

a first conductive layer over the first channel formation region.

4. The semiconductor device according to claim 2, further comprising:

a second conductive layer over the second oxide semiconductor layer; and

a pixel electrode layer electrically connected to the second conductive layer,

wherein the pixel electrode layer has a light-transmitting property.

5. The semiconductor device according to claim 2,

wherein the first source electrode layer and the first drain electrode layer are a single layer or a stacked layer comprising any one of molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, and scandium.

6. The semiconductor device according to claim 2,

wherein the second source electrode layer and the second drain electrode layer are a single layer or a stacked layer comprising any one of indium oxide, an alloy of indium oxide and tin oxide, an alloy of indium oxide and zinc oxide, and zinc oxide.

7. The semiconductor device according to claim 2, further comprising:

a first oxide conductive layer between the first oxide semiconductor layer and the first source electrode layer; and

a second oxide conductive layer between the first oxide semiconductor layer and the first drain electrode layer.

8. The semiconductor device according to claim 7,

wherein each of the first oxide conductive layer and the second oxide conductive layer is a layer comprising indium oxide, an alloy of indium oxide and tin oxide, an alloy of indium oxide and zinc oxide, or zinc oxide.

9. The semiconductor device according to claim 2,

wherein each of the first oxide semiconductor layer and the second oxide semiconductor layer comprises indium, gallium, and zinc.

10. The semiconductor device according to claim 2,

wherein the first electrode is electrically independent from the second electrode.

11. The semiconductor device according to claim 2, further comprising an oxide insulating layer over the first source electrode layer, the first drain electrode layer, and the second oxide semiconductor layer.

12. A semiconductor device comprising:

a first transistor in a driver circuit, the first transistor comprising;

a first gate electrode layer over an insulating surface;

a gate insulating layer over the first gate electrode layer;

a first oxide semiconductor layer over the first gate electrode layer; and

a first source electrode layer and a first drain electrode layer over the first oxide semiconductor layer;

a second transistor in a pixel, the second transistor comprising;

a second gate electrode layer over the insulating surface;

the gate insulating layer over the second gate electrode layer;

a second source electrode layer and a second drain electrode layer over the gate insulating layer; and

a second oxide semiconductor layer over the second gate electrode layer, the second source electrode layer and the second drain electrode layer; and

a capacitor comprising;

a first electrode over the insulating surface;

the gate insulating layer over the first electrode;

a second electrode over the gate insulating layer; and

an oxide conductor layer over the second electrode,

wherein each of the second gate electrode layer, the gate insulating layer, the second source electrode layer, the second drain electrode layer, and the second oxide semiconductor layer has a light-transmitting property.

13. The semiconductor device according to claim 12,

wherein each of the first oxide semiconductor layer and the second oxide semiconductor layer comprises indium, gallium, and zinc.

14. The semiconductor device according to claim 12, further comprising:

a first channel formation region in the first oxide semiconductor layer; and

a first conductive layer over the first channel formation region.

15. The semiconductor device according to claim 12,

wherein the second oxide semiconductor layer comprises a channel formation region, and

wherein the second oxide semiconductor layer covers both end portions of the second source electrode layer and both end portions of the second drain electrode layer in a channel length direction.

16. The semiconductor device according to claim 12,

wherein each of the first transistor and the second transistor is over a substrate.

17. The semiconductor device according to claim 12, further comprising:

a second conductive layer over the second oxide semiconductor layer; and

a pixel electrode layer electrically connected to the second conductive layer,

wherein the pixel electrode layer has a light-transmitting property.

18. The semiconductor device according to claims 12,

wherein the first electrode is electrically independent from the second electrode.

19. The semiconductor device according to claim 12, further comprising an oxide insulating layer over the first source electrode layer, the first drain electrode layer, and the second oxide semiconductor layer.