SEMICONDUCTOR LIGHT-EMITTING DEVICES

• US 20140231849A1
• Filed: 12/03/2013
• Published: 08/21/2014
• Est. Priority Date: 02/15/2013
• Status: Abandoned Application

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.), Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: SONG, Sang-Yeob, KIM, Hyun-Young, KIM, Gi-Bum, YOON, Ju-Heon, LEE, Wan-Ho, HUR, Won-Goo
• Application Number:
  US14/094,942
• Publication Number:
  US 20140231849A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Semiconductor light-emitting devices including a semiconductor region that includes a light-emitting structure; and an electrode layer including a first reflection metal layer that contacts a first portion of the semiconductor region and being configured to reflect light from the light-emitting structure and a second reflection metal layer that contacts a second portion of the semiconductor region and being configured to reflect light from the light-emitting structure, wherein the second reflection metal layer is spaced apart from the first reflection metal layer and at least partially covers the first reflection metal layer.

Claims

1. A semiconductor light-emitting device, comprising:

a semiconductor region including a light-emitting structure; and

an electrode layer including,

a first reflection metal layer contacting a first portion of the semiconductor region, the first reflection metal layer being configured to reflect light from the light-emitting structure, and

a second reflection metal layer contacting a second portion of the semiconductor region, and the second reflection metal layer being configured to reflect light from the light-emitting structure,

the second reflection metal layer being spaced apart from the first reflection metal layer and at least partially covering the first reflection metal layer.

2. The semiconductor light-emitting device of claim 1, wherein each of the first reflection metal layer and the second reflection metal layer has a reflectance of at least 80% with respect to light generated by the light-emitting structure.

3. The semiconductor light-emitting device of claim 1, wherein the first reflection metal layer and the second reflection metal layer are formed of the same material.

4. The semiconductor light-emitting device of claim 1, wherein the first reflection metal layer and the second reflection metal layer are formed of different materials.

5. The semiconductor light-emitting device of claim 1, wherein, in the semiconductor region, the second portion has a shape that surrounds the first portion.

6. The semiconductor light-emitting device of claim 1, wherein the first portion and the second portion are spaced apart from each other.

7. The semiconductor light-emitting device of claim 1, wherein the first portion and the second portion contact each other at least partially.

8. The semiconductor light-emitting device of claim 1, wherein,

the first reflection metal layer covers a first area of the semiconductor region,

the second reflection metal layer covers a second area of the semiconductor region, and

the second area is greater than the first area.

9. The semiconductor light-emitting device of claim 1, wherein each of the first reflection metal layer and the second reflection metal layer is formed of at least one selected from silver (Ag), aluminum (Al), nickel (Ni), chromium (Cr), palladium (Pd), copper (Cu), platinum (Pt), tin (Sn), tungsten (W), gold (Au), rhodium (Rh), iridium (Ir), ruthenium (Ru), magnesium (Mg), zinc (Zn), and an alloy thereof.

10. The semiconductor light-emitting device of claim 1, wherein,

the electrode layer further comprises a conductive electrode fixing layer between the first reflection metal layer and the second reflection metal layer, and

the electrode layer is formed of a material different from a material of each of the first reflection metal layer and the second reflection metal layer.

11. The semiconductor light-emitting device of claim 10, wherein the conductive electrode fixing layer comprises:

a close-contact layer on the first reflection metal layer,

a mechanical adhesive force between the first reflection metal layer and the first portion of the semiconductor region being greater when the close-contact layer is present as opposed to a mechanical adhesive force between the first reflection metal layer and the first portion of the semiconductor region when the close-contact layer is excluded from the conductive electrode fixing layer; and

an adhesive layer between the close-contact layer and the second reflection metal layer.

12. The semiconductor light-emitting device of claim 1, wherein the electrode layer further comprises a conductive diffusion barrier film covering the second reflection metal layer.

13. The semiconductor light-emitting device of claim 1, wherein the second reflection metal layer completely covers the first reflection metal layer.

14. A semiconductor light-emitting device comprising:

a semiconductor region including a light-emitting structure having a first semiconductor layer, an active layer, and a second semiconductor layer;

a first electrode layer contacting the first semiconductor layer; and

a second electrode layer contacting the second semiconductor layer,

at least one of the first electrode layer and the second electrode layer including a plurality of reflection metal layers,

the plurality of reflection metal layers being spaced apart from one another and overlapping with one another,

each of the plurality of reflection metal layers having a reflective surface contacting the semiconductor region.

15. The semiconductor light-emitting device of claim 14, wherein the plurality of reflection metal layers comprise:

a first reflection metal layer having a first reflective surface contacting a first portion of the semiconductor region; and

a second reflection metal layer having a second reflective surface contacting a second portion of the semiconductor region.

16. The semiconductor light-emitting device of claim 15, further comprising:

at least one conductive layer between the first reflection metal layer and the second reflection metal layer,

the at least one conductive layer having a third reflectance lower than a first reflectance of the first reflection metal layer and a second reflectance of the second reflection metal layer.

17. A semiconductor light-emitting device, comprising:

a semiconductor region including a light-emitting structure; and

a first electrode structure including a first metal layer and a second metal layer spaced apart from each other,

the first metal layer and the second metal layer contacting different areas of the semiconductor region,

the second metal layer extends over the first metal layer, and

the first metal layer and the second metal layer being configured to reflect light from the light-emitting structure.

18. The semiconductor light-emitting device of claim 17, wherein

the light-emitting structure includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers,

a second electrode structure contacts a first surface of the second semiconductor layer,

the second semiconductor layer has a second surface opposing the first surface, and

the second surface is uneven.

19. The semiconductor light-emitting device of claim 17, wherein

the first metal layer and the second metal layer contact a first area and a second area of the semiconductor region, respectively, and

the second metal layer covers an upper surface of the first metal layer.

20. The semiconductor light-emitting device of claim 19, wherein the first area and the second area of the semiconductor region abut each other.