LIGHT EMITTING DIODE

• US 20140231851A1
• Filed: 01/29/2014
• Published: 08/21/2014
• Est. Priority Date: 02/04/2013
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Tsai, Yao-Jun, Hsu, Chen-Peng, Wen, Shih-Yi, Chang, Yu-Hsiang, Hu, Hung-Lieh, Yang, Chi-Chin, Lin, Re-Ching
• Granted Patent: US 9,391,239 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second surface opposite to each other and has a first region and a second region. The second semiconductor layer is disposed on the second surface. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The substrate has a first conductive layer and a second conductive layer thereon. The first electrode is disposed between the second semiconductor layer and the first conductive layer. The second electrode is disposed on the first surface. The third electrode is disposed between the second region and the second conductive layer, and electrically connected to the second electrode.

Claims

1. A light emitting diode, comprising:

a semiconductor stacked structure, comprising;

a first semiconductor layer comprising a first surface and a second surface opposite to each other, the first semiconductor layer comprising a first region and a second region;

a second semiconductor layer disposed on the second surface and located in the first region; and

a light emitting layer disposed between the first semiconductor layer and the second semiconductor layer;

a substrate disposed opposite to the semiconductor stacked structure and toward the second surface, wherein the substrate has a first conductive layer and a second conductive layer thereon;

a first electrode disposed between the second semiconductor layer and the first conductive layer;

a second electrode disposed on the first surface; and

a third electrode at least located in the second region and at least a part of the third electrode disposed between the first semiconductor layer and the second conductive layer, the third electrode being electrically connected to the second electrode.

2. The light emitting diode according to claim 1, wherein the second region comprises an opening extending from the second surface to the first surface, and a bottom of the opening is a third surface, wherein the third electrode is disposed on the third surface.

3. The light emitting diode according to claim 1, wherein the second region is located on an edge of the second surface.

4. The light emitting diode according to claim 1, wherein the second region is completely surrounded by the first region.

6. The light emitting diode according to claim 1, further comprising a fourth electrode disposed in the first semiconductor layer and connected to the second electrode and the third electrode.

7. The light emitting diode according to claim 1, further comprising a protection layer disposed between the second semiconductor layer and the third electrode.

8. The light emitting diode according to claim 1, further comprising a fourth electrode disposed on a sidewall of the first semiconductor layer and connected to the second electrode and the third electrode.

9. The light emitting diode according to claim 8, further comprising a protection layer disposed between the first semiconductor layer and the fourth electrode.

10. The light emitting diode according to claim 2, wherein an area of the second region is smaller than or equal to 13% of a total area of the first region and the second region.

12. The light emitting diode according to claim 1, further comprising a protection layer disposed on a sidewall of the opening and on the second semiconductor layer around the opening.

13. The light emitting diode according to claim 1, further comprising an undoped semiconductor layer disposed on an edge of the first surface and surrounding the first surface, the second electrode being disposed on the undoped semiconductor layer and the first surface.

14. The light emitting diode according to claim 1, further comprising at least one island structure disposed in the second region, the island structure having a top surface coplanar with a top surface of the second semiconductor layer, the third electrode being disposed between the island structure and the second region, wherein the island structure consists of the first semiconductor layer, the light emitting layer and the second semiconductor layer.

15. The light emitting diode according to claim 1, wherein the first electrode comprises:

a mirror layer disposed on the second semiconductor layer;

a barrier layer covering the mirror layer; and

a bonding layer disposed on the barrier layer.

16. The light emitting diode according to claim 15, further comprising a protection layer disposed on a sidewall of the opening, the second semiconductor layer around the opening and the barrier layer, a portion of the third electrode being located on the protection layer.

17. The light emitting diode according to claim 1, wherein a sidewall of the first semiconductor layer is an inclined plane.

18. The light emitting diode according to claim 1, further comprising a ring-shaped electrode, wherein the second region surrounds the light emitting layer, and the ring-shaped electrode is disposed in the second region.

19. The light emitting diode according to claim 1, wherein the second electrode comprises a plurality of first sub-electrodes, the third electrode comprises a plurality of second sub-electrodes, and each of the second sub-electrodes is connected between the corresponding first sub-electrode and the corresponding second wiring layer.

20. The light emitting diode according to claim 1, further comprising a roughened structure disposed on the first surface.

21. The light emitting diode according to claim 1, further comprising a photonic crystal disposed on the first surface.

22. The light emitting diode according to claim 1, wherein the semiconductor stacked structure has a thickness of less than 20 μ

m.

5. (canceled)

11. (canceled)