LED CHIP RESISTANT TO ELECTROSTATIC DISCHARGE AND LED PACKAGE INCLUDING THE SAME
First Claim
Patent Images
1. A light emitting diode chip comprising:
- a substrate;
a light emitting diode section disposed on the substrate; and
an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section.
1 Assignment
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Accused Products
Abstract
A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. In the light emitting diode chip, the light emitting diode section is disposed together with the inverse parallel diode section.
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Citations
24 Claims
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1. A light emitting diode chip comprising:
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a substrate; a light emitting diode section disposed on the substrate; and an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A light emitting diode chip comprising:
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a substrate; a light emitting diode section disposed on the substrate; an inverse parallel diode section disposed on the substrate; a first electrode pad disposed on the inverse parallel diode section; a second electrode pad disposed on the light emitting diode section; a first extension extending from the first electrode pad and connected to the light emitting diode section; and a second extension extending from the second electrode pad and connected to the inverse parallel diode section, wherein the inverse parallel diode section is connected inversely parallel to the light emitting diode section. - View Dependent Claims (22)
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23. A light emitting diode package comprising:
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a chip mounting section having a chip mounting face; and a light emitting diode chip mounted on the chip mounting face, wherein the light emitting diode chip comprises; a substrate; a light emitting diode section disposed on the substrate; and an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. - View Dependent Claims (24)
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Specification