LIGHT EMITTER COMPONENTS AND METHODS HAVING IMPROVED PERFORMANCE

• US 20140239325A1
• Filed: 02/22/2013
• Published: 08/28/2014
• Est. Priority Date: 02/22/2013
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter Scott, Adames, Luis
• Granted Patent: US 8,916,896 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Light emitter components and methods having improved performance and related methods are disclosed. In one embodiment, a light emitter component can include a submount and at least one light emitting diode (LED) chip disposed over the submount. The submount can contact at least two different sides of the at least one LED chip. In one aspect, a submount can include surface portions adapted to receive portions one or more LED chips. In one aspect, one or more LED chips can be embedded within the submount.

Claims

1. A light emitter component comprising:

a submount comprising ceramic;

at least one light emitting diode (LED) chip disposed within a portion of the submount; and

wherein the submount contacts at least two different sides of the at least one LED chip.

2. The component according to claim 1, wherein the at least one LED chip is embedded within a portion of the submount.

3. The component according to claim 1, wherein the submount comprises one or more surface portions adapted to receive a portion of the at least one LED chip.

4. The component according to claim 3, wherein the one or more surface portions comprises a recess.

5. The component according to claim 3, wherein the one or more surface portions comprises a groove.

7. The component according to claim 1, wherein the ceramic based material comprises alumina.

8. The component according to claim 1, wherein the submount comprises a first layer of material and a second layer of material.

9. The component according to claim 8, wherein the first layer of material comprises a ceramic plate of alumina, and wherein the second layer of material comprises light scattering particles disposed in a matrix material.

10. The component according to claim 9, wherein the light scattering particles comprise one or more particles of Al2O3, TiO2, BaSO4, and/or AlN.

11. The component according to claim 9, wherein the light scattering particles are loaded between approximately 3 weight percent (wt. %) and approximately 50 wt. % within the matrix material.

12. The component according to claim 11, wherein the light scattering particles are uniformly loaded within portions of submount.

13. The component according to claim 11, wherein the light scattering particles are variably loaded within portions submount.

14. The component according to claim 1, wherein a reflective material is provided within a portion of submount.

15. The component according to claim 14, wherein the reflective material is provided below a portion of the LED chip.

16. The component according to claim 14, wherein the reflective material is applied to a bottom surface of submount.

17. The component according to claim 14, wherein the reflective material comprises silver.

6. (canceled)

18. A light emitter component comprising:

a submount comprising ceramic;

at least one light emitting diode (LED) chip having multiple surfaces embedded within a portion of the submount; and

wherein the submount is adapted to reflect light emitted from at least one LED chip.

19. The component according to claim 18, wherein the submount contacts the LED chip in at least two points.

20. The component according to claim 18, wherein the submount contacts the LED chip in at least three points.

21. The component according to claim 18, wherein the submount contacts the LED chip in at least four points.

22. The component according to claim 18, wherein the submount contacts the LED chip in at least five points.

23. The component according to claim 18, wherein the submount contacts the LED chip in at least six points.

25. The component according to claim 18, wherein the ceramic based material comprises alumina.

26. The component according to claim 18, wherein the submount comprises a first layer of material and a second layer of material.

27. The component according to claim 26, wherein the first layer of material comprises a ceramic plate of alumina, and wherein the second layer of material comprises light scattering particles disposed in a matrix material.

28. The component according to claim 27, wherein the light scattering particles comprise one or more particles of Al2O3, TiO2, BaSO4, and/or AlN.

29. The component according to claim 27, wherein the light scattering particles comprise a variable packing density within portions submount such that at least a first area of the submount is more densely loaded with light scattering particles than a second area.

30. The component according to claim 18, wherein a reflective material is provided within a portion of submount.

31. The component according to claim 30, wherein the reflective material is applied to a bottom surface of submount.

24. (canceled)

32. The component according to claim 32, wherein the reflective material comprises silver.

33. A submount comprising:

a body comprising ceramic;

a surface feature disposed in the body, wherein the surface feature is adapted to receive a portion of a light emitting diode (LED) chip and contact multiple surfaces of the LED chip.

34. The submount according to claim 33, wherein the surface feature comprises a recess.

35. The submount according to claim 33, wherein the surface feature comprises a groove.

36. The submount according to claim 35, wherein the groove comprises a V-shaped cross section.

37. The submount according to claim 33, wherein at least a portion of the submount comprises alumina.

38. The submount according to claim 33, wherein the submount comprises a first layer of material and a second layer of material.

39. The submount according to claim 38, wherein the first layer of material comprises a ceramic plate of alumina, and wherein the second layer of material comprises light scattering particles disposed in a matrix material.

40. The submount according to claim 39, wherein the light scattering particles comprise one or more particles of Al2O3, TiO2, BaSO4, and/or AlN.

41. The submount according to claim 33, wherein the submount comprises optical conversion materials dispersed within the ceramic based body of material.

42. The submount according to claim 33, further comprising a reflective material buried within a portion of the submount.

43. The submount according to claim 42, wherein the reflective material is provided below a portion of the LED chip.

44. The component according to claim 42, wherein the reflective material is applied to a bottom surface of the submount.

45. The component according to claim 42, wherein the reflective material comprises silver.

46. A method of providing a light emitter component, the method comprising:

providing a submount; and

embedding at least a portion of a light emitting diode (LED) chip within a portion of the submount, the submount being adapted to reflect light emitted from the LED chip.

47. The method according to claim 46, wherein embedding the at least one LED chip comprises pressing the LED chip into a portion of the submount.

48. The method according to claim 46, wherein embedding the at least one LED chip comprises attaching the LED chip to a surface portion disposed in the submount.

49. The method according to claim 48, wherein the surface portion comprises a recess.

50. The method according to claim 48, wherein the surface portion comprises a groove.

51. The method according to claim 46, wherein providing a submount comprises providing a body comprising ceramic.

52. The method according to claim 46, further comprising providing a reflective material within a portion of the submount.

53. The method according to claim 46, further comprising providing a reflective layer within a portion of the submount.

54. The method according to claim 46, wherein the reflective layer comprises silver.

55. A method for controlling light output from a light emitting component, the method comprising:

providing a submount;

providing light scattering particles within the submount such that at least a first area of the submount is more densely packed with the light scattering particles than a second area of the submount; and

emitting light from at least one light emitting diode (LED) chip such that light is reflected out of the second area of the submount.

56. The method according to claim 55, wherein providing a submount comprises providing a ceramic based submount.

57. The method according to claim 55, wherein providing light scattering particles comprises providing particles of Al2O3, TiO2, BaSO4, and/or AlN in a matrix material.

58. The method according to claim 57, wherein the matrix material comprises silicone or glass.

59. The method according to claim 55, further comprising providing a reflective material within a portion of the submount.

60. The method according to claim 55, further comprising providing a reflective layer within a portion of the submount.

61. The method according to claim 60, wherein the reflective layer comprises silver.