ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS

• US 20140239481A1
• Filed: 05/01/2014
• Published: 08/28/2014
• Est. Priority Date: 11/15/2011
• Status: Active Grant

• Current Assignee: Henkel AG & Co KGaA
• Original Assignee: Henkel AG & Co KGaA, Henkel IP & Holding GmbH (Henkel AG & Co KGaA)
• Inventors: Nguyen, My Nhu, Barriau, Emilie, Renkel, Martin, Brandi, Jason, Holloway, Matthew J.
• Granted Patent: US 9,209,105 B2
• Time in Patent Office: Days
• US Class Current: 257/707
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Provided herein are electronic devices assembled with thermally insulating layers.

Claims

1. A consumer electronic article of manufacture comprising:

A housing comprising at least one substrate having an interior surface and an exterior surface;

A layer of thermally insulating elements disposed on at least a portion of the interior surface of the at least one substrate; and

At least one semiconductor package comprising an assembly comprising at least one of

I.

a semiconductor chip;

a heat spreader; and

a thermal interface material therebetween, or

II.

a heat spreader;

a heat sink; and

a thermal interface material therebetween.

2. The article of claim 1, further comprising a venting element to disperse generated heat from the semiconductor assembly from the article.

3. The article of manufacture of claim 1, wherein the housing comprises at least two substrates.

4. The article of manufacture of claim 1, wherein the housing comprises a plurality of substrates.

5. The article of manufacture of claim 1, wherein the substrates are dimensioned and disposed to engage one another.

6. The article of manufacture of claim 1, wherein the layer of thermally insulating elements is disposed on at least a portion of the interior surface of the at least one substrate, the complementary exterior surface of which comes into contact with the end user when in use.

7. The article of manufacture of claim 1, wherein the thermally insulating elements comprise a gas.

8. The article of manufacture of claim 1, wherein the thermally insulating elements comprise air.

9. The article of manufacture of claim 1, wherein the thermally insulating elements comprise a gas within a hollow sphere-like vessel.

10. The article of manufacture of claim 1, wherein the thermally insulating elements are used at a concentration within the range of 25% to 99% by volume in a liquid carrier vehicle.

11. The article of manufacture of claim 1, wherein the thermally insulating elements are applied to the surface in dispersion or a suspension in a liquid carrier vehicle.

12. The article of manufacture of claim 1, wherein the thermally insulating elements are applied to the surface in a dispersion or a suspension in a liquid carrier vehicle comprising water.

13. The article of manufacture of claim 1, wherein the thermally insulating elements are applied to the surface in a dispersion or a suspension in a liquid carrier vehicle comprising polymeric emulsions.

14. The article of manufacture of claim 1, wherein the thermal interface material comprises a phase change material.

15. The article of manufacture of claim 1, wherein the thermal interface material comprises thermal grease.

16. The article of manufacture of claim 1, wherein the thermal interface material comprises a thermally-conductive composition for facilitating the transfer of heat from an electronic component to a heat sink comprising:

(a) 60% to 90% by weight of paraffin;

(b) 0% to 5% by weight of resin; and

(c) 10% to 40% by weight of an electrically-conductive filler.

17. The article of manufacture of claim 1, wherein the electrically-conductive filler is selected from the group consisting of graphite, diamond, silver, copper and alumina.

18. The article of manufacture of claim 1, wherein the composition has a melting point of approximately 51°

C.

19. The article of manufacture of claim 1, wherein the composition has a melting point of approximately 60°

C.

20. The article of manufacture of claim 1, wherein the thermal interface material comprises a curable matrix material;

fusible metal solder particles substantially devoid of added lead, comprising an elemental solder powder and optionally a solder alloy; and

optionally, a catalyst.

21. The article of manufacture of claim 1, wherein the thermal interface material has a thermal impedance (°

C. cm²/Watt) of less than 0.2.

22. The article of manufacture of claim 1, wherein the article is a notebook personal computer, tablet personal computer or a handheld device.