INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES

• US 20140239482A1
• Filed: 02/26/2013
• Published: 08/28/2014
• Est. Priority Date: 02/26/2013
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Kourakata, Shinobu, Ogata, Kazuo
• Granted Patent: US 9,236,323 B2
• Time in Patent Office: Days
• US Class Current: 257/712
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

Claims

1. An integrated heat spreader, comprising:

a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame, wherein the plurality of openings each define at least one opening sidewall extending between the heat spreader frame first surface and the heat spreader frame second surface;

a plurality of thermally conductive structures, each having a first surface, an opposing second surface, a least one sidewall extending between the thermally conductive structure first surface and the thermally conductive structure second surface, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings with the at least one thermally conductive structure sidewall abutting its corresponding at least one heat spreader frame sidewall.

2. The integrated heat spreader of claim 1, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings by pressure between the at least one thermally conductive structure sidewall and its corresponding at least one heat spreader frame sidewall.

3. The integrated heat spreader of claim 1, wherein the thermally conductive structure first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface.

4. The integrated heat spreader of claim 1, wherein the heat spreader frame has a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface;

wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and

wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame.

5. The integrated heat spreader of claim 1, wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface;

and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of another one of the plurality of thermally conductive structures.

6. A microelectronic structure, comprising:

a microelectronic substrate;

a multi-chip package electrically connected to the microelectronic substrate, wherein the multi-chip packing includes a plurality of microelectronic devices disposed thereon; and

an integrated heat spreader attached to the microelectronic substrate, comprising;

a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame, wherein the plurality of openings each define at least one opening sidewall extending between the heat spreader frame first surface and the heat spreader frame second surface; and

a plurality of thermally conductive structures, each having a first surface, an opposing second surface, a least one sidewall extending between the thermally conductive structure first surface and the thermally conductive structure second surface, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings with the at least one thermally conductive structure sidewall abutting its corresponding at least one heat spreader frame sidewall, and wherein the second surface of each of the plurality of thermally conductive structures is in thermal contact with a corresponding microelectronic device of the multi-chip package.

7. The microelectronic structure of claim 6, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings by pressure between the at least one thermally conductive structure sidewall and its corresponding at least one heat spreader frame sidewall.

8. The microelectronic structure of claim 6, wherein the thermally conductive structure first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface.

9. The microelectronic structure of claim 6, wherein the heat spreader frame has a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface;

wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and

wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame.

10. The microelectronic structure of claim 6, wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface;

and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of another one of the plurality of thermally conductive structures.

11. The microelectronic structure of claim 6, wherein the heat spreader frame is attached to the microelectronic substrate.

12. The microelectronic structure of claim 11, wherein the heat spreader frame further includes at least one footing extending therefrom and wherein the at least one heat spreader frame footing is attached to the microelectronic substrate.

13. An electronic system, comprising:

a housing;

a microelectronic substrate disposed within the housing;

a microelectronic substrate;

a multi-chip package electrically connected to the microelectronic substrate, wherein the multi-chip packing includes a plurality of microelectronic devices disposed thereon; and

an integrated heat spreader attached to the microelectronic substrate, comprising;

a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame, wherein the plurality of openings each define at least one opening sidewall extending between the heat spreader frame first surface and the heat spreader frame second surface; and

a plurality of thermally conductive structures, each having a first surface, an opposing second surface, a least one sidewall extending between the thermally conductive structure first surface and the thermally conductive structure second surface, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings with the at least one thermally conductive structure sidewall abutting its corresponding at least one heat spreader frame sidewall, and wherein the second surface of each of the plurality of thermally conductive structures is in thermal contact with a corresponding microelectronic device of the multi-chip package.

14. The electronic system of claim 13, wherein each of the plurality of thermally conductive structures are secured within a corresponding plurality of openings by pressure between the at least one thermally conductive structure sidewall and its corresponding at least one heat spreader frame sidewall.

15. The electronic system of claim 13, wherein the thermally conductive structure first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface.

16. The electronic system of claim 13, wherein the heat spreader frame has a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface;

wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and

wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame.

17. The electronic system of claim 13, wherein each thermally conductive structure has a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface;

and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of another one of the plurality of thermally conductive structures.

18. The electronic system of claim 13, wherein the heat spreader frame is attached to the microelectronic substrate.

19. The electronic system of claim 18, wherein the heat spreader frame further includes at least one footing extending therefrom and wherein the at least one heat spreader frame footing is attached to the microelectronic substrate.

20. A method, comprising:

forming a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame;

forming a plurality of thermally conductive structures; and

securing each of the plurality of thermally conductive structures within corresponding heat spreader frame openings.

21. The method of claim 20, wherein securing each of the plurality of thermally conductive structures within the corresponding plurality of openings comprises securing each of the plurality of thermally conductive structures within the corresponding plurality of openings by pressure between the at least one thermally conductive structure sidewall and its corresponding at least one heat spreader frame sidewall.

22. The method of claim 20, wherein securing each of the plurality of thermally conductive structures within corresponding heat spreader frame openings further comprises securing each of the plurality of thermally conductive structures within corresponding heat spreader frame openings such that the thermally conductive structure first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface.

23. The method of claim 20, wherein forming the heat spreader frame comprises forming the heat spreader frame to have a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface;

wherein forming the plurality of thermally conductive structures comprises forming each thermally conductive structures to have a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and

wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame.

24. The method of claim 20, wherein forming the plurality of thermally conductive structures comprises forming each thermally conductive structure to have a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface;

and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of another one of the plurality of thermally conductive structures.

25. The method of claim 20, further comprising:

forming a microelectronic substrate;

electrically connecting a multi-chip package to the microelectronic substrate, wherein the multi-chip packing includes a plurality of microelectronic devices disposed thereon; and

thermally contacting the second surface of each of the plurality of thermally conductive structures with a corresponding microelectronic device of the multi-chip package.

26. The method structure of claim 25, further comprising attaching the heat spreader frame to the microelectronic substrate.

27. The microelectronic structure of claim 26, wherein attaching the heat spreader frame to the microelectronic substrate comprises attaching at least one footing extending from the heat spreader to the microelectronic substrate.