FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION
First Claim
1. An electroless aqueous copper plating solution, comprisinga source of copper ions,a source of glyoxylic acid, as reducing agent, andat least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, as complexing agent,wherein the molar ratio of the complexing agent to copper ions is in the range of 1.1:
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Accused Products
Abstract
The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
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Citations
15 Claims
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1. An electroless aqueous copper plating solution, comprising
a source of copper ions, a source of glyoxylic acid, as reducing agent, and at least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, as complexing agent, wherein the molar ratio of the complexing agent to copper ions is in the range of 1.1:
Specification