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FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION

  • US 20140242264A1
  • Filed: 10/01/2012
  • Published: 08/28/2014
  • Est. Priority Date: 10/05/2011
  • Status: Abandoned Application
First Claim
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1. An electroless aqueous copper plating solution, comprisinga source of copper ions,a source of glyoxylic acid, as reducing agent, andat least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, as complexing agent,wherein the molar ratio of the complexing agent to copper ions is in the range of 1.1:

  • 1 to 5;

    1.

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