METHOD OF MANUFACTURING A RESISTIVE TOUCH SENSOR CIRCUIT BY FLEXOGRAPHIC PRINTING
First Claim
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1. A method for manufacturing a resistive touch sensor circuit comprising:
- creating a first circuit component, wherein creating the first circuit component comprises;
printing, by a flexographic printing process using a first master plate and a first ink, a first pattern on a first side of the first substrate;
curing the substrate;
depositing, by an electroless plating process, a first conductive material on the first side of the first substrate;
printing, by the flexographic printing process using a second master plate and a second ink, a first plurality of spacer microstructures; and
subsequently curing the substrate;
creating a second circuit component comprising;
printing, by the flexographic printing process using a third master plate and a third ink, a second pattern on a first side of the second substrate;
curing the substrate;
depositing, by the electroless plating process, a second conductive material on the first side of the second substrate;
printing, by the flexographic printing process using a fourth master plate and a fourth ink, a second plurality of spacer microstructures; and
subsequently curing the substrate.
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Abstract
Method of manufacturing a resistive touch sensor circuit using a roll to roll process to print microscopic patterns on a single side of at least one flexible dielectric substrate using a plurality of flexo-masters to print the microscopic patterns which are then plated to form conductive microscopic patterns.
8 Citations
20 Claims
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1. A method for manufacturing a resistive touch sensor circuit comprising:
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creating a first circuit component, wherein creating the first circuit component comprises; printing, by a flexographic printing process using a first master plate and a first ink, a first pattern on a first side of the first substrate; curing the substrate; depositing, by an electroless plating process, a first conductive material on the first side of the first substrate; printing, by the flexographic printing process using a second master plate and a second ink, a first plurality of spacer microstructures; and subsequently curing the substrate; creating a second circuit component comprising; printing, by the flexographic printing process using a third master plate and a third ink, a second pattern on a first side of the second substrate; curing the substrate; depositing, by the electroless plating process, a second conductive material on the first side of the second substrate; printing, by the flexographic printing process using a fourth master plate and a fourth ink, a second plurality of spacer microstructures; and subsequently curing the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing a resistive touch sensor circuit comprising:
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cleaning a substrate, wherein a plane of the substrate comprises an X and a Y axis; printing, by a flexographic process using a first master plate and a first ink, a first pattern on a first side of the substrate, printing, by a flexographic process using a second master plate and the first ink, a second pattern on the first side of the substrate; curing the substrate; depositing, by an electroless plating process, a conductive material on the first side of the substrate, printing, by a flexographic process using a third master plate and a second ink, a plurality of spacer microstructures on the same area of the substrate where the first pattern was printed; subsequently, curing the substrate. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method for manufacturing a resistive touch sensor circuit comprising:
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printing, using a first master plate and a first ink, a first pattern on a first side of the substrate; printing, by a flexographic printing process using a second master plate and a second ink, a second pattern on the first side of the substrate, wherein the first and the second patterns are printed adjacent to each other along a surface plane of the substrate; curing the substrate; depositing, by an electroless plating process, a conductive material on the first, patterned side of the substrate. - View Dependent Claims (17, 18, 19, 20)
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Specification