BOOSTER ANTENNA, CONTACTLESS CHIP ARRANGEMENT, ANTENNA STRUCTURE AND CHIP ARRANGEMENT
First Claim
Patent Images
1. A booster antenna for a chip arrangement, the booster antenna comprising:
- a first circuit, which forms a first resonant circuit;
a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit;
a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit.
1 Assignment
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Abstract
In various embodiments, a booster antenna for a chip arrangement is provided. The booster antenna includes: a first circuit, which forms a first resonant circuit; a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit; and a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit.
17 Citations
26 Claims
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1. A booster antenna for a chip arrangement, the booster antenna comprising:
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a first circuit, which forms a first resonant circuit; a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit; a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A contactless chip arrangement, comprising:
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a first circuit, which forms a first resonant circuit; a second circuit, which forms a second resonant circuit, wherein the first circuit is electrically conductively connected to the second circuit; a third circuit, which forms a third resonant circuit, wherein the third circuit is electrically conductively connected to the second circuit; a contactless chip module, which comprises; a chip; and a coil, which is electrically coupled to the chip; wherein the booster antenna is inductively coupled to the coil of the contactless chip module, by means of at least one inductive coupling region of the booster antenna. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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24. An antenna structure, comprising:
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a coil antenna with a plurality of coil turns; wherein the antenna structure is designed such that a standing wave of an antenna signal is formed on said antenna structure. - View Dependent Claims (25)
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26. A chip arrangement, comprising:
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at least one chip; an antenna structure coupled to the chip, the antenna structure comprising; a coil antenna with a plurality of coil turns; wherein the antenna structure is designed such that a standing wave of an antenna signal is formed on said antenna structure.
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Specification