HIGH DENSITY, LOW LOSS 3-D THROUGH-GLASS INDUCTOR WITH MAGNETIC CORE

• US 20140247269A1
• Filed: 03/04/2013
• Published: 09/04/2014
• Est. Priority Date: 03/04/2013
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Kim, Jonghae, Zuo, Chengjie, Yun, Changhan Hobie, Velez, Mario Francisco, Lan, Je-Hsiung Jeffrey, Berdy, David Francis, Kim, Daeik Daniel
• Application Number:
  US13/784,580
• Publication Number:
  US 20140247269A1
• Time in Patent Office: Days
• US Class Current: 345/501
• CPC Class Codes: G06T 1/00 General purpose image data processing
• CPC Class Codes: H01F 1/24 the particles being insulated
• CPC Class Codes: H01F 1/37 in a bonding agent
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/498 Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers shape of the substrate H01L23/13
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/097 Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
• CPC Class Codes: H05K 2201/10242 Metallic cylinders small solder preforms other than balls H05K2203/0415
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Abstract

This disclosure provides systems, methods and apparatus for three-dimensional (3-D) through-glass via inductors. In one aspect, the through-glass via inductor includes a glass substrate with a first cavity, a second cavity, and at least two through-glass vias. The through-glass vias include metal bars that are connected by a metal trace. The metal bars and the metal trace define the inductor, and each cavity is at least partially filled with magnetic material. The magnetic material can include a plurality of particles having an average diameter of less than about 20 nm. The first cavity can be inside the inductor and the second cavity can be outside inductor. In some implementations, the first and the second cavity can be vias that extend only partially through the glass substrate.

Claims

1. A device comprising:

a glass substrate;

a first cavity defined in the glass substrate;

a second cavity defined in the glass substrate, wherein magnetic material is disposed in both the first and the second cavity;

at least two through-glass vias extending through the glass substrate, wherein the at least two through-glass vias include metal bars, and wherein the first cavity is between the through-glass vias and at least one of the through-glass vias is between the first cavity and the second cavity; and

a metal trace connecting the metal bars between the at least two through-glass vias.

2. The device of claim 1, wherein the magnetic material includes a plurality of magnetic particles, the average diameter of the particles being less than about 20 nm.

3. The device of claim 2, wherein the magnetic particles include ferrite.

4. The device of claim 2, wherein the magnetic particles are substantially coated with insulating material.

5. The device of claim 4, wherein the average thickness of the coating is between about 5 nm and about 100 nm.

6. The device of claim 4, wherein the insulating material includes silicon oxide (SiOx).

7. The device of claim 1, further comprising a third cavity defined in the glass substrate, wherein magnetic material is disposed in the third cavity, and wherein the metal bars are between the second cavity and the third cavity.

8. The device of claim 1, further comprising a magnetic coating disposed on the metal trace.

9. The device of claim 1, wherein the first cavity and the second cavity are connected with each other to form a continuous cavity within the glass substrate.

10. The device of claim 1, wherein each of the first and the second cavity is a via extending only partially through the glass substrate.

11. The device of claim 1, wherein the glass substrate includes a photoimageable glass.

12. The device of claim 1, wherein the glass substrate has a thickness between about 30 microns and about 1 millimeter.

13. The device of claim 1, wherein the metal trace and the metal bars define at least a portion of one of a plurality of metal turns arranged in a solenoidal inductor.

14. The device of claim 1, the metal trace and the metal bars define at least a portion of one of a plurality of metal turns arranged in a toroidal inductor.

15. An apparatus comprising:

the device of claim 1;

a display;

a processor that is configured to communicate with the display, the processor being configured to process image data; and

a memory device that is configured to communicate with the processor.

16. The apparatus of claim 15, further comprising:

a driver circuit configured to send at least one signal to the display; and

a controller configured to send at least a portion of the image data to the driver circuit.

17. The apparatus of claim 15, further comprising:

an image source module configured to send the image data to the processor, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter; and

an input device configured to receive input data and to communicate the input data to the processor.

18. A method comprising:

providing a glass substrate;

forming at least two through-glass vias extending through the glass substrate;

forming a first cavity in the glass substrate, wherein the first cavity is between the at least two through-glass vias;

forming one or more second cavities in the glass substrate, wherein at least one of the through-glass vias is between the first cavity and the one or more second cavities;

depositing magnetic material in the first cavity and the one or more second cavities;

depositing a metal to at least partially fill the through-glass vias to form metal bars in the through-glass vias; and

depositing a metal trace between the through-glass vias to connect the metal bars.

19. The method of claim 18, wherein the magnetic material includes a plurality of magnetic particles, the average diameter of the particles being less than about 20 nm.

20. The method of claim 19, wherein the magnetic particles include ferrite.

21. The method of claim 19, further comprising coating the magnetic particles with insulating material.

22. The method of claim 21, wherein the average thickness of the coating is between about 5 nm and about 100 nm.

23. The method of claim 21, wherein the insulating material includes silicon oxide (SiOx).

24. The method of claim 18, further comprising forming a magnetic coating on the metal trace.

25. The method of claim 18, wherein forming the first cavity and forming the one or more second cavities includes connecting the first and the one or more second cavities to form a continuous cavity.

26. The method of claim 18, wherein each of the first cavity and the one or more second cavities is a via extending only partially through the glass substrate.

27. The method of claim 18, wherein forming the at least two through-glass vias includes:

exposing an area of the glass substrate to ultraviolet radiation;

exposing the glass substrate to an elevated temperature; and

etching the area of the glass substrate to form the at least two through-glass vias.

28. The method of claim 18, wherein forming the first cavity and the one or more second cavities includes:

exposing an area of the glass substrate to ultraviolet radiation;

exposing the glass substrate to an elevated temperature; and

etching the area of the glass substrate to form the first cavity and the one or more second cavities.

29. The method of claim 18, wherein forming the at least two through-glass vias and forming the first and the one or more second cavities occur simultaneously or at different times.

30. The method of claim 18, wherein forming the at least two through-glass vias includes at least one of a sandblasting process, a laser ablation process, a glass forming process, an ultrasonic drilling process, and an etch process.