Food Preparation Appliance

• US 20140251164A1
• Filed: 03/06/2014
• Published: 09/11/2014
• Est. Priority Date: 03/06/2013
• Status: Abandoned Application

• Current Assignee: Ehsan Alipour, Farshad Moinzadeh, Joseph Benjamin Strecker
• Original Assignee: Ehsan Alipour, Farshad Moinzadeh, Joseph Benjamin Strecker
• Inventors: Alipour, Ehsan, Strecker, Joseph Benjamin, Moinzadeh, Farshad
• Application Number:
  US14/199,230
• Publication Number:
  US 20140251164A1
• Time in Patent Office: Days
• US Class Current: 99/483
• CPC Class Codes: A47J 27/10 Cooking-vessels with water-bath arrangements for domestic use

Abstract

A food preparation apparatus includes a thermal fluid reservoir formed with an internal cavity for holding a thermal transfer fluid. A fluid transfer unit circulates the thermal transfer fluid through the reservoir and through a thermal transfer unit. The thermal fluid reservoir may be formed into a food receptacle with a thermal contact surface for the reservoir coincident with a food contact surface in the receptacle. Alternatively, a food receptacle may be formed separately from the reservoir and may either attach to the thermal contact surface or may be easily removable. Embodiments may selectively heat or cool food in the food receptacle by transferring thermal energy between the thermal transfer fluid and the thermal contact surface. A setpoint temperature is accurately maintained everywhere on the thermal transfer surface to avoid hot spots or cold spots in the food receptacle.

Claims

1. An apparatus, comprising:

a thermal fluid reservoir formed with an internal cavity for holding a thermal transfer fluid, comprising a thermal contact surface adapted for transferring thermal energy between said thermal fluid reservoir and a food item;

a fluid transfer unit in fluid communication with said internal cavity in said thermal fluid reservoir;

a thermal transfer unit in fluid communication with said fluid transfer unit and with said internal cavity in said thermal fluid reservoir;

a temperature and flow controller in electrical communication with said fluid transfer unit and said thermal transfer unit; and

a user interface module in electrical communication with said temperature and flow controller,

wherein said temperature and flow controller is adapted to maintain a temperature of said thermal contact surface at a setpoint temperature received by said temperature and flow controller from said user interface module.

2. The apparatus of claim 1, wherein said thermal transfer unit comprises a resistive electric heater.

3. The apparatus of claim 1, where said thermal transfer unit comprises an infrared heater.

4. The apparatus of claim 1, wherein said thermal transfer unit comprises a microwave transmitter.

5. The apparatus of claim 1, wherein said thermal transfer unit comprises a solid-state thermoelectric device adapted for heating and cooling.

6. The apparatus of claim 1, wherein said fluid transfer unit comprises a positive displacement pump.

7. The apparatus of claim 1, wherein said thermal fluid reservoir is formed into a food receptacle with said thermal contact surface corresponding to an inner bottom surface of said food receptacle.

8. The apparatus of claim 1, further comprising a temperature sensor adapted to measure a temperature of a thermal transfer fluid inside said thermal fluid reservoir.

9. The apparatus of claim 1, further comprising a temperature sensor adapted to measure a temperature of said thermal contact surface.

10. The apparatus of claim 9, wherein said temperature and flow controller, said temperature sensor, said thermal transfer unit, and said fluid transfer unit implement closed-loop feedback control of said temperature of said thermal contact surface.

11. An apparatus, comprising:

a thermal fluid reservoir formed with an internal cavity for holding a thermal transfer fluid, comprising a thermal contact surface;

a food receptacle adapted for a close fit against said thermal fluid reservoir;

a fluid transfer unit in fluid communication with said internal cavity in said thermal fluid reservoir;

a thermal transfer unit in fluid communication with said fluid transfer unit and with said internal cavity in said thermal fluid reservoir;

a temperature and flow controller in electrical communication with said fluid transfer unit and said thermal transfer unit; and

a user interface module in electrical communication with said temperature and flow controller,

wherein said temperature and flow controller is adapted to maintain a temperature of said thermal contact surface at a setpoint temperature received by said temperature and flow controller from said user interface module.

12. The apparatus of claim 11, wherein said food receptacle is adapted for easy removal and reinstallation in said apparatus.

13. The apparatus of claim 11, wherein said thermal transfer unit comprises a resistive electric heater.

14. The apparatus of claim 11, where said thermal transfer unit comprises an infrared heater.

15. The apparatus of claim 11, wherein said thermal transfer unit comprises a heat exchanger.

16. The apparatus of claim 11, wherein said thermal transfer unit comprises a solid-state thermoelectric device adapted for heating and cooling.

17. The apparatus of claim 11, wherein said fluid transfer unit comprises a positive displacement pump.

18. The apparatus of claim 11, wherein said thermal fluid reservoir is formed with a protrusion through which thermal transfer fluid may flow and said food receptacle is formed with a depression adapted to receive said protrusion.

19. The apparatus of claim 11, further comprising a temperature sensor adapted to measure a temperature of said thermal contact surface.

20. The apparatus of claim 19, wherein said temperature and flow controller, said temperature sensor, said thermal transfer unit, and said fluid transfer unit implement closed-loop feedback control of said temperature of said thermal contact surface.