HEATED SUBSTRATE SUPPORT WITH FLATNESS CONTROL

• US 20140251214A1
• Filed: 03/06/2013
• Published: 09/11/2014
• Est. Priority Date: 03/06/2013
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: CUVALCI, OLKAN, TZU, GWO-CHUAN, YUAN, XIAOXIONG
• Application Number:
  US13/787,385
• Publication Number:
  US 20140251214A1
• Time in Patent Office: Days
• US Class Current: 118/712
• CPC Class Codes: G01K 3/10 in respect of time, e.g. reacting only to a quick change of temperature
• CPC Class Codes: H01L 21/67103 mainly by conduction

Abstract

Embodiments of heated substrate supports are provided herein, In some embodiments, a heated substrate support includes a support plate having a top surface and an opposite bottom surface; and a first heater disposed within the support plate, wherein the first heater is disposed beneath a mid-plane of the support plate, and wherein the first heater is disposed proximate a central zone of the support plate.

Claims

1. A heated substrate support, comprising:

a support plate having a top surface and an opposite bottom surface; and

a first heater disposed within the support plate, wherein the first heater is disposed beneath a mid-plane of the support plate, and wherein the first heater is disposed proximate a central zone of the support plate.

2. The heated substrate support of claim 1, further comprising:

a second heater disposed within the support plate between the mid-plane and the bottom surface in a second zone independent of the central zone.

3. The heated substrate support of claim 1, further comprising:

a first sensor to provide data corresponding to a temperature in the central zone.

4. The heated substrate support of claim 3, further comprising:

a first controller coupled to the first sensor and the first heater to control the temperature of the central zone in response to the data provided by the first sensor.

5. The heated substrate support of claim 4, further comprising:

a second heater disposed within the support plate between the mid-plane and the bottom surface in a second zone independent of the central zone; and

a second sensor to provide data corresponding to a temperature of the second zone.

6. The heated substrate support of claim 5, further comprising:

a second controller coupled to the second sensor and the second heater to control the temperature of the second zone in response to the data provided by the second sensor.

7. The heated substrate support of claim 6, wherein the first controller and the second controller are the same controller.

8. The heated substrate support of claim 5, wherein the second zone comprises an outer zone.

9. The heated substrate support of claim 5, wherein the first heater and the second heater are substantially coplanar.

10. The heated substrate support of claim 1, wherein the support plate comprises a top plate coupled to a bottom plate, wherein the first heater is disposed in a channel formed in at least one of the top plate or the bottom plate.

11. The heated substrate support of claim 10, wherein the top plate is at least as thick as the bottom plate, and wherein the first heater is disposed in a channel formed in the bottom plate.

12. The heated substrate support of claim 1, wherein the support plate is fabricated from aluminum or an aluminum alloy.

13. The heated substrate support of claim 1, further comprising:

a shaft coupled to the support plate.

14. The heated substrate support of claim 13, wherein the shaft is directly coupled to the support plate.

15. A heated substrate support, comprising:

a support plate having a top surface and an opposite bottom surface;

a shaft coaxial with the support plate and coupled to the bottom surface;

a first heater disposed within a central zone of the support plate beneath a mid-plane of the support plate;

a second heater disposed within a second zone of the support plate beneath the mid-plane of the support plate;

a first sensor to provide data corresponding to a temperature in the central zone; and

a second sensor to provide data corresponding to a temperature in the second zone.

16. The heated substrate support of claim 15, further comprising:

one or more controllers coupled to the first and second sensors and the first and second heaters to respectively and independently control the temperature of the central zone in response to the data provided by the first sensor and the temperature of the second zone in response to the data provided by the second sensor.

17. The heated substrate support of claim 15, wherein the support plate comprises a top plate coupled to a bottom plate, wherein the first heater is disposed in a channel formed in at least one of the top plate or the bottom plate.

18. The heated substrate support of claim 17, wherein the top plate is at least as thick as the bottom plate, and wherein the first heater is disposed in a channel formed in the bottom plate.

19. A method for controlling the flatness of a substrate support, comprising:

energizing a heater element disposed within a support plate of the substrate support and beneath a mid-plane of the support plate;

sensing a temperature of a central zone within the support plate;

comparing the temperature of the central zone with a predetermined temperature corresponding to a thermal expansion of a portion of the support plate; and

deenergizing the heater element if the sensed temperature is equal to or greater than the predetermined temperature.

20. The method of claim 19, further comprising:

if the sensed temperature is less than the predetermined temperature, determining if the heater element is energized; and

energizing the heater element if the heater element is not energized.